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STV6413D

STMicroelectronics

STV6413D by STMicroelectronics

STV6413D by STMicroelectronics is a low-profile audio/video switch featuring 11 channels and operates at a nominal voltage of 5 V. It supports temperatures from 0 °C to 70 °C and comes in a compact square package with 64 terminals. Ideal for multiplexing applications, it ensures reliable performance in commercial settings.

Median Price

$2.800

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 128 parts In-Stock

1+ parts

$2.800

100+ parts

-

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128

$2.800

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DF Sales Co.

USA . 128 parts In-Stock

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$2.800

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128

$2.800

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Digiode

USA . 2,618 parts In-Stock

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2,618

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Anansix

USA . 1,715 parts In-Stock

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1,715

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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500

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ComSIT Distribution GmbH

Germany . 482 parts In-Stock

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482

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Vyrian

USA . 64 parts In-Stock

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64

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Ashlea Components Ltd

UK . 39 parts In-Stock

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39

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LWI Electronics Inc

India . 28 parts In-Stock

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28

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LittleDiode

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$5.230

100+ parts

-

1k+ parts

$4.707

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532

$5.230

-

$4.707

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MKK Technologies

India . 258 parts In-Stock

1+ parts

$9.835

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258

$9.835

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DigiPath Technology Company

USA . 258 parts In-Stock

1+ parts

$9.835

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258

$9.835

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GreenTree Electronics

Israel . 70,277 parts In-Stock

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Authorized Procurement Solutions

USA . 28,224 parts In-Stock

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28,224

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A-Z Elektronik GmbH

Germany . 4,863 parts In-Stock

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4,863

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Corphita

USA . 4,021 parts In-Stock

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4,021

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Assy Fe

Spain . 1,920 parts In-Stock

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1,920

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Kepictronics

USA . 960 parts In-Stock

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960

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Parana Technologies

USA . 794 parts In-Stock

1+ parts

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100+ parts

$6.254

1k+ parts

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794

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$6.254

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Overview

Elevate your designs with the STV6413D from STMicroelectronics, a premium multiplexer that seamlessly integrates into audio and video applications. Designed for reliability and efficiency, its low-profile package ensures optimal space-saving without compromising performance. Experience superior signal quality and effortless switching capabilities, backed by ST's renowned engineering expertise. Whether in consumer electronics or industrial systems, the STV6413D delivers unparalleled value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and facilitates automated assembly processes.

Package Shape: SQUARE

The square package shape is optimized for PCB layout, enabling compact design and ensuring efficient use of space.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard for many applications, ensuring compatibility with common electronic systems.

Power Supplies (V): 5,12

The flexibility of dual power supply options (5V and 12V) enhances versatility in applications requiring different voltage levels.

No. of Terminals: 64

With 64 terminals, this component offers extensive connectivity options, suitable for complex circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style supports low-profile designs which are essential for space-constrained applications while ensuring fine pitch for increased connection density.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and performance in a wide range of thermal environments.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures this component can function effectively in colder environments, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and superior conductivity, enhancing overall performance.

Terminal Position: QUAD

Quad terminal position allows for multiple connections, making the product suitable for complex routing in densely packed PCBs.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm is ideal for low-profile designs, making it suitable for compact devices.

Width: 10 mm

A width of 10 mm maintains a compact footprint, which is advantageous in size-sensitive applications.

Other IC type: AUDIO/VIDEO SWITCH

Designed specifically as an audio/video switch, this product is tailored for high-frequency signal applications, providing optimal performance in multimedia devices.

Minimum Supply Voltage (Vsup): 4.75 V

The ability to operate at a minimum voltage of 4.75V enhances compatibility with devices operating at lower voltage ranges.

Length: 10 mm

A length of 10 mm enables a compact design while ensuring ease of integration into various layouts.

Temperature Grade: COMMERCIAL

Being commercially graded indicates suitability for consumer electronics, ensuring reliability in everyday applications.

No. of Channels: 11

Having 11 channels allows for versatile signal switching, making it a suitable choice for complex audio/video requirements.

Terminal Form: GULL WING

The gull wing terminal form enhances the mounting stability and soldering process, ensuring a reliable electrical connection.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high density and compact layouts, making it ideal for modern electronic designs.

Maximum Supply Voltage (Vsup): 5.25 V

A maximum supply voltage of 5.25V provides a small margin above the nominal voltage, enabling this device to handle minor voltage fluctuations effectively.

Technical Specifications

Multiplexers & Switches STV6413D attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Channels:

11

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

STV6413D Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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