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STV6410D

STMicroelectronics

STV6410D by STMicroelectronics

STV6410D by STMicroelectronics is a versatile audio/video switch featuring 31 channels and operates at a nominal voltage of 8V. Its compact flatpack design (10x10 mm) ensures efficient space utilization in applications. With a max temp of 70 °C, it’s ideal for commercial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,867 parts In-Stock

1+ parts

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100+ parts

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2,867

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Digiode

USA . 2,627 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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2,627

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Anansix

USA . 2,342 parts In-Stock

1+ parts

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2,342

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$7.407

100+ parts

-

1k+ parts

$6.666

10k+ parts

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111

$7.407

-

$6.666

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MKK Technologies

India . 366 parts In-Stock

1+ parts

$13.928

100+ parts

-

1k+ parts

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10k+ parts

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366

$13.928

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DigiPath Technology Company

USA . 366 parts In-Stock

1+ parts

$13.928

100+ parts

-

1k+ parts

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10k+ parts

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366

$13.928

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Corphita

USA . 2,838 parts In-Stock

1+ parts

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2,838

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Parana Technologies

USA . 835 parts In-Stock

1+ parts

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100+ parts

$8.856

1k+ parts

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10k+ parts

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835

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$8.856

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Overview

Elevate your audio and video applications with the STV6410D from STMicroelectronics—a leader in innovation and quality. This low-profile, high-performance multiplexer offers seamless integration and reliability, ensuring optimal signal routing for superior performance. With 31 channels and robust temperature tolerance, it’s perfect for advanced consumer electronics, enhancing clarity and efficiency. Trust STMicroelectronics for unmatched value and cutting-edge technology that powers your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and longevity in diverse applications.

Surface Mount: YES

Facilitates easier assembly and integration into complex circuit boards, saving space.

Package Shape: SQUARE

Square shape provides symmetrical design benefits, improving heat dissipation and layout flexibility.

Nominal Supply Voltage (Vsup): 8 V

Ideal for standard applications requiring a moderate supply voltage, enhancing compatibility.

Power Supplies (V): 8, 12

Versatility in power supply options makes it suitable for a wide range of devices.

No. of Terminals: 64

High terminal count allows for complex switching configurations, increasing design possibilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact profile minimizes space on PCBs, advantageous for modern electronic designs.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Functionality across a broad temperature range ensures adaptability in various conditions.

Terminal Finish: TIN LEAD

Reliable lead finish supports soldering processes and enhances connection stability.

Terminal Position: QUAD

Quad terminal arrangement aids in efficient signal routing and connectivity in circuits.

Maximum Seated Height: 1.6 mm

Low profile allows for denser PCB layouts, making this product ideal for compact devices.

Width (mm): 10 mm

Standard width suitable for various applications, ensuring compatibility with different PCB designs.

Other IC type: AUDIO/VIDEO SWITCH

Specialized for audio and video applications, enhancing performance in multimedia systems.

Length: 10 mm

Predictable dimensions ease integration into designs while providing uniformity across applications.

Temperature Grade: COMMERCIAL

Meets commercial temperature standards, ensuring reliability for everyday application scenarios.

No. of Channels: 31

Provides extensive channel support, enabling complex audio/video switching solutions.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Terminal Pitch: 0.5 mm

Fine pitch allows for greater density of connections, which is beneficial for limited-space designs.

Technical Specifications

Multiplexers & Switches STV6410D attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

10 mm

No. of Channels:

31

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

8,12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

STV6410D Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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