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STV6412BD

STMicroelectronics

STV6412BD by STMicroelectronics

STV6412BD by STMicroelectronics is a 64-terminal audio/video switch with power supplies of 5V and 12V. It operates b/w 0-70 °C, has matte tin terminal finish, and quad terminal position. Ideal for commercial applications requiring a surface-mount square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,754 parts In-Stock

1+ parts

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4,754

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Vyrian

USA . 1,651 parts In-Stock

1+ parts

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-

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1,651

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Anansix

USA . 1,296 parts In-Stock

1+ parts

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1,296

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ACDS - Activité Composants Distribution Service

France . 990 parts In-Stock

1+ parts

-

100+ parts

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990

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,220 parts In-Stock

1+ parts

$12.739

100+ parts

-

1k+ parts

$11.465

10k+ parts

-

2,220

$12.739

-

$11.465

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MKK Technologies

India . 533 parts In-Stock

1+ parts

$23.955

100+ parts

-

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533

$23.955

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DigiPath Technology Company

USA . 533 parts In-Stock

1+ parts

$23.955

100+ parts

-

1k+ parts

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533

$23.955

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-

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GreenTree Electronics

Israel . 12,000 parts In-Stock

1+ parts

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12,000

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A-Z Elektronik GmbH

Germany . 4,943 parts In-Stock

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4,943

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Corphita

USA . 3,414 parts In-Stock

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3,414

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,218 parts In-Stock

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2,218

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Kepictronics

USA . 1,605 parts In-Stock

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1,605

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Cyclops Electronics Ltd (Excess)

UK . 990 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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990

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Parana Technologies

USA . 973 parts In-Stock

1+ parts

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100+ parts

$15.232

1k+ parts

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10k+ parts

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973

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$15.232

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Overview

Upgrade your audio/video systems with the STV6412BD switch from STMicroelectronics. Built with top-quality materials and advanced technology, this multiplexer offers seamless switching capabilities for a wide range of applications. With its reliable performance and versatile features, this product ensures smooth operation and enhanced functionality. Trust in the expertise of STMicroelectronics to deliver the best-in-class solutions for your electronic needs. Experience the value and efficiency that the STV6412BD brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and allowing for more flexible layout options.

Power Supplies (V): 5,12

The product supports multiple power supply options (5V and 12V), making it versatile and compatible with different systems and applications.

No. of Terminals: 64

With 64 terminals, the product offers ample connectivity options, enabling the switching of multiple audio/video inputs and outputs efficiently.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even under challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows the product to function effectively in a wide range of operating environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good electrical conductivity and solderability, ensuring stable connections and long-term performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, making it suitable for reflow soldering processes during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250 °C allows for reliable soldering of the product on circuit boards without compromising performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets standard operating temperature requirements for commercial applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, enhancing the overall durability and reliability of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables high-density mounting of the product on circuit boards, optimizing space and allowing for more compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture during storage and handling, ensuring its reliability and performance in various environments.

Technical Specifications

Multiplexers & Switches STV6412BD attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

250

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STV6412BD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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