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CD74HC4067ME4

Texas Instruments

CD74HC4067ME4 by Texas Instruments

CD74HC4067ME4 by Texas Instruments is a CMOS multiplexer with 16 channels, 180 ohm max resistance, and 75 dB isolation. It operates b/w -55 to 125 °C with a supply voltage range of 2-6 V. Ideal for applications requiring precise signal routing in compact electronic systems.

Median Price

$15.922

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,000 parts In-Stock

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$15.922

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$15.126

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$15.126

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$15.922

$15.126

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Digiode

USA . 1,508 parts In-Stock

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$15.126

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Vyrian

USA . 7,801 parts In-Stock

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Prism Electronics

USA . 100 parts In-Stock

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Nova Conductors

Japan . 78 parts In-Stock

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Parana Technologies

USA . 960 parts In-Stock

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$11.809

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$12.210

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$11.809

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DigiPath Technology Company

USA . 819 parts In-Stock

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$13.004

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$11.963

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$13.004

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IDEA Electronic Components Group

UK . 2,376 parts In-Stock

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$13.269

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$12.606

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$11.942

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$11.942

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ChromeModa Solutions

Germany . 161 parts In-Stock

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$13.269

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$10.881

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Semicontronic

India . 778 parts In-Stock

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$13.530

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$13.192

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$13.124

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Corphita

USA . 768 parts In-Stock

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$14.330

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corohmni

South Africa . 638 parts In-Stock

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$18.932

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$18.932

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Ampacity Inc.

Singapore . 865 parts In-Stock

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$29.460

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Continental Prestige Electronics

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Perfect Parts

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Argo Parts USA

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Robosynatics

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Lucentia Tech

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Bastille Electronics

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Overview

Experience unparalleled quality and reliability with the CD74HC4067ME4 by Texas Instruments, a leading manufacturer in the industry. This multiplexer offers versatility in applications such as signal routing and data acquisition, providing customers with seamless functionality and performance. With a compact design and high-grade materials, this product ensures durability and stability. Trust in Texas Instruments to deliver exceptional value and innovation with the CD74HC4067ME4, making it the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring longevity and reliability.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V allows for efficient power usage while still maintaining optimal performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this multiplexer can withstand extreme conditions and environments.

No. of Channels: 16

Having 16 channels allows for versatile connectivity options and the ability to switch between multiple inputs or outputs with ease.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature ensures that there is no overlap or short circuiting during signal switching, enhancing the overall safety of the system.

Technical Specifications

Multiplexers & Switches CD74HC4067ME4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

24

Nominal Off-state Isolation:

75 dB

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

180 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

58 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

CD74HC4067ME4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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