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TS3USB221RSERG4

Texas Instruments

TS3USB221RSERG4 by Texas Instruments

TS3USB221RSERG4 by Texas Instruments is a 1-channel differential multiplexer with 2.5V nominal voltage, 1100 kHz nominal bandwidth, and 40 dB off-state isolation. It is ideal for industrial applications requiring fast switching times (50 ns on, 23 ns off) in a compact chip carrier package with very thin profile.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,064 parts In-Stock

1+ parts

$1.160

100+ parts

$0.806

1k+ parts

$0.526

10k+ parts

-

8,064

$1.160

$0.806

$0.526

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.536

-

-

-

Digiode

USA . 4,941 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

4,941

$1.102

-

-

-

Chip Stock

USA . 34,070 parts In-Stock

1+ parts

-

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34,070

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-

-

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Vyrian

USA . 4,047 parts In-Stock

1+ parts

-

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-

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4,047

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-

-

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NPI Materials, Inc.

USA . 115 parts In-Stock

1+ parts

-

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-

1k+ parts

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115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,958 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

-

3,958

$0.348

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.526

100+ parts

-

1k+ parts

$0.505

10k+ parts

-

500

$0.526

-

$0.505

-

Continental Prestige Electronics

USA . 1,562 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

$0.526

1,562

$0.536

-

-

$0.526

Argo Parts USA

USA . 258 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

$0.520

258

$0.536

-

-

$0.520

Semicontronic

India . 5,334 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

-

5,334

$0.990

$0.965

$0.960

-

Corphita

USA . 397 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$1.044

-

-

-

Parana Technologies

USA . 541 parts In-Stock

1+ parts

$8.141

100+ parts

-

1k+ parts

$8.739

10k+ parts

-

541

$8.141

-

$8.739

-

ChromeModa Solutions

Germany . 5,182 parts In-Stock

1+ parts

$9.147

100+ parts

$7.501

1k+ parts

-

10k+ parts

-

5,182

$9.147

$7.501

-

-

IDEA Electronic Components Group

UK . 1,787 parts In-Stock

1+ parts

$9.147

100+ parts

$8.690

1k+ parts

$8.232

10k+ parts

-

1,787

$9.147

$8.690

$8.232

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Corohmni

South Africa . 248 parts In-Stock

1+ parts

$11.258

100+ parts

-

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-

10k+ parts

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248

$11.258

-

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$25.313

100+ parts

$24.048

1k+ parts

$24.048

10k+ parts

-

750

$25.313

$24.048

$24.048

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

-

100+ parts

$8.247

1k+ parts

-

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1,114

-

$8.247

-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Kepictronics

USA . 744 parts In-Stock

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744

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$1.108

1k+ parts

$1.108

10k+ parts

$1.108

350

-

$1.108

$1.108

$1.108

Overview

Enhance your electronic designs with the TS3USB221RSERG4 by Texas Instruments, a top-of-the-line multiplexer and switch that delivers unrivaled quality and reliability. Made from high-quality plastic/epoxy materials, this chip carrier offers separate outputs, low on-state resistance, and quick switching times, making it ideal for industrial applications. With a wide supply voltage range and excellent isolation properties, this versatile component ensures seamless performance in various scenarios. Upgrade your projects with Texas Instruments' superior technology and experience the difference in efficiency and functionality.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the internal components.

Surface Mount

YES - Allows for easy installation on circuit boards.

No. of Functions

1 - Simplifies the design and operation of the device.

Package Shape

RECTANGULAR - Offers a compact and space-saving form factor.

Nominal Supply Voltage (Vsup)

2.5 V - Compatible with a wide range of systems and power sources.

No. of Terminals

10 - Provides flexibility and connectivity options for different configurations.

Package Style (Meter)

CHIP CARRIER, VERY THIN PROFILE - Enables high-density mounting in tight spaces.

Maximum Operating Temperature

85 °C - Ensures reliable performance in various environmental conditions.

Minimum Operating Temperature

40 °C - Suitable for use in extreme cold environments.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Enhances conductivity and corrosion resistance.

Terminal Position

QUAD - Facilitates easy connection to other components on the circuit board.

Output (V)

SEPARATE OUTPUT - Allows for individual control and monitoring of the output signal.

Maximum Seated Height

0.6 mm - Contributes to a low-profile design for space-constrained applications.

Width (mm)

1.5 mm - Offers a slim and compact form factor for efficient PCB layout.

Other IC type

DIFFERENTIAL MULTIPLEXER - Provides advanced signal processing capabilities for enhanced performance.

Minimum Supply Voltage (Vsup)

2.3 V - Ensures reliable operation even at lower voltage levels.

Peak Reflow Temperature °C

260 - Allows for safe and efficient soldering during assembly.

Maximum On-state Resistance (Ron)

6 ohm - Helps minimize power loss and heat generation in the circuit.

Maximum Switch-on Time

50 ns - Enables fast switching for real-time applications.

Length

2 mm - Contributes to a compact overall footprint for space-saving installations.

Maximum Switch-off Time

23 ns - Ensures quick and efficient signal switching for optimal performance.

Temperature Grade

INDUSTRIAL - Suitable for use in industrial applications with wide temperature ranges.

Maximum Supply Current (Isup)

0.03 mA - Low power consumption for energy-efficient operation.

No. of Channels

1 - Supports single-channel signal routing for simplified configurations.

Nominal Bandwidth

1100 kHz - Provides high-frequency signal processing capabilities for data-intensive applications.

Terminal Form

NO LEAD - Offers a lead-free construction for compliance with environmental regulations.

Terminal Pitch

0.5 mm - Allows for precise and secure connections between components.

Moisture Sensitivity Level (MSL)

1 - Resistant to moisture damage for long-lasting reliability.

Maximum Supply Voltage (Vsup)

3.6 V - Supports a wide range of voltage inputs for versatile compatibility.

Nominal Off-state Isolation

40 dB - Ensures minimal interference between channels for accurate signal routing.

Minimum Input Voltage

0 V - Compatible with zero input voltage levels for flexible signal processing.

Switching (V)

BREAK-BEFORE-MAKE - Prevents signal overlap during switching, ensuring smooth operation.

Nominal On-state Resistance Match

0.2 ohm - Provides balanced signal paths for consistent performance.

Maximum Input Voltage

5.5 V - Handles high input voltage levels for robust signal processing.

Technical Specifications

Multiplexers & Switches TS3USB221RSERG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

1100 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

.2 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Maximum Switch-off Time:

23 ns

Maximum Switch-on Time:

50 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.5 mm

Trade Compliance

TS3USB221RSERG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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