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TS3USB3031RMGR

Texas Instruments

TS3USB3031RMGR by Texas Instruments

TS3USB3031RMGR by Texas Instruments is a 2-channel differential multiplexer with 6 ohm max on-state resistance. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Package style: chip carrier, very thin profile, ideal for space-constrained designs.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 28,891 parts In-Stock

1+ parts

$1.100

100+ parts

$0.634

1k+ parts

$0.549

10k+ parts

$0.517

28,891

$1.100

$0.634

$0.549

$0.517

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$0.585

100+ parts

-

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56

$0.585

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Digiode

USA . 2,987 parts In-Stock

1+ parts

$1.796

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2,987

$1.796

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Chip Stock

USA . 31,170 parts In-Stock

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31,170

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Vyrian

USA . 24,110 parts In-Stock

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Component Sense

UK . 6,183 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,205 parts In-Stock

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SPM Sales

USA . 2,402 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 24,485 parts In-Stock

1+ parts

$0.408

100+ parts

$0.398

1k+ parts

$0.396

10k+ parts

-

24,485

$0.408

$0.398

$0.396

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Ampacity Inc.

Singapore . 24,423 parts In-Stock

1+ parts

$0.408

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24,423

$0.408

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Argo Parts USA

USA . 3,685 parts In-Stock

1+ parts

$0.585

100+ parts

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$0.568

3,685

$0.585

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$0.568

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.585

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500

$0.585

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Continental Prestige Electronics

USA . 431 parts In-Stock

1+ parts

$0.585

100+ parts

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$0.573

431

$0.585

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-

$0.573

Corohmni

South Africa . 272 parts In-Stock

1+ parts

$1.066

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272

$1.066

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Corphita

USA . 4,843 parts In-Stock

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$1.701

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4,843

$1.701

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$14.299

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$13.585

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$13.585

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59

$14.299

$13.585

$13.585

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Parana Technologies

USA . 265 parts In-Stock

1+ parts

$17.988

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$18.150

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265

$17.988

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$18.150

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DigiPath Technology Company

USA . 1,293 parts In-Stock

1+ parts

$19.807

100+ parts

$18.222

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1,293

$19.807

$18.222

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ChromeModa Solutions

Germany . 4,795 parts In-Stock

1+ parts

$20.211

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$16.573

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4,795

$20.211

$16.573

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IDEA Electronic Components Group

UK . 2,295 parts In-Stock

1+ parts

$20.211

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$19.200

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$18.190

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2,295

$20.211

$19.200

$18.190

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Lixinc

USA . 14,653 parts In-Stock

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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S.R.D Solutions

India . 5,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,626 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,828 parts In-Stock

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A-Z Elektronik GmbH

Germany . 386 parts In-Stock

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386

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Overview

Upgrade your electronics with the TS3USB3031RMGR by Texas Instruments, a top-quality multiplexer and switch that guarantees reliable performance. With Texas Instruments' reputation for excellence, you can trust that this product will meet your needs in various applications. Enjoy the benefits of seamless switching, separate outputs, and a wide temperature range, all in a compact and durable package. Elevate your projects with the value and precision that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount option allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in demanding settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures stability and performance even in extreme cold environments.

Output (V): SEPARATE OUTPUT

Separate output feature allows for individual signal processing, enhancing flexibility and customization in applications.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement makes the product energy efficient and suitable for low-power applications.

No. of Channels: 2

Having 2 channels increases the versatility of the product, allowing for multiple signal inputs or outputs to be switched or multiplexed.

Nominal Bandwidth: 6500 kHz

High nominal bandwidth enables fast and efficient signal processing, making this product suitable for applications requiring high-speed data transfer.

Technical Specifications

Multiplexers & Switches TS3USB3031RMGR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

6500 kHz

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

2

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.75 mm

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.8 mm

Trade Compliance

TS3USB3031RMGR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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