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TS3USB31RSER

Texas Instruments

TS3USB31RSER by Texas Instruments

TS3USB31RSER by Texas Instruments is a 2-channel DPDT switch with 8 terminals, operating at -40 to 85°C. It features a max on-state resistance of 10 ohm and separate outputs. Ideal for industrial applications requiring a compact (0.6mm) chip carrier package with very thin profile (1.5x1.5mm).

Median Price

$0.810

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Texas Instruments

USA . 8,845 parts In-Stock

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$0.568

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$0.437

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$0.230

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8,845

$0.568

$0.437

$0.230

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DigiKey

USA . 8,043 parts In-Stock

1+ parts

$0.810

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$0.458

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$0.394

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$0.361

8,043

$0.810

$0.458

$0.394

$0.361

Mouser Electronics

USA . 1,089 parts In-Stock

1+ parts

$0.810

100+ parts

$0.458

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$0.409

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-

1,089

$0.810

$0.458

$0.409

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Distributors (In-Stock)

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Nova Conductors

Japan . 55 parts In-Stock

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$0.421

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55

$0.421

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Digiode

USA . 3,226 parts In-Stock

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$0.540

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Chip Stock

USA . 304,500 parts In-Stock

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Martec Srl

Italy . 17,500 parts In-Stock

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Vyrian

USA . 8,653 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,780 parts In-Stock

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2,780

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Pride Electronics

USA . 178 parts In-Stock

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Elcom Components

USA . 110 parts In-Stock

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Holdelec - ElecDif-Pro

France . 60 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,414 parts In-Stock

1+ parts

$0.421

100+ parts

-

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$0.413

3,414

$0.421

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-

$0.413

Argo Parts USA

USA . 1,204 parts In-Stock

1+ parts

$0.421

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$0.409

1,204

$0.421

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$0.409

Netroflash

USA . 100 parts In-Stock

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$0.421

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100

$0.421

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Ampacity Inc.

Singapore . 8,621 parts In-Stock

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$0.483

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Corphita

USA . 4,430 parts In-Stock

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$0.511

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$0.511

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Corohmni

South Africa . 466 parts In-Stock

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$2.089

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466

$2.089

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Parana Technologies

USA . 1,991 parts In-Stock

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$12.115

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$12.523

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1,991

$12.115

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$12.523

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DigiPath Technology Company

USA . 2,020 parts In-Stock

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$13.340

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$12.273

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$13.340

$12.273

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$13.612

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$12.931

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$12.251

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1,546

$13.612

$12.931

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ChromeModa Solutions

Germany . 385 parts In-Stock

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$13.612

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$11.162

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385

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Perfect Parts

USA . 69,562 parts In-Stock

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Lixinc

USA . 16,592 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,560 parts In-Stock

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Futuretech Components

Singapore . 2,260 parts In-Stock

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iodParts Technologies Inc.

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Kepictronics

USA . 136 parts In-Stock

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Overview

Experience seamless and efficient data switching with the TS3USB31RSER by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions in the Multiplexers & Switches category. This chip carrier with a very thin profile offers separate outputs, ensuring precision in signal transmission. With a nominal bandwidth of 1220 kHz and a minimum input voltage of 0 V, this switch guarantees smooth operation. Trust Texas Instruments for superior performance and exceptional value in your electronic applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, making this multiplexer/switch compatible with a wide range of applications.

No. of Channels: 2

Having 2 channels allows for the switching or multiplexing of signals from two different sources, providing flexibility in routing and managing electronic signals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand elevated temperatures, making it suitable for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function reliably even in cold environments, expanding its utility in various conditions.

Maximum On-state Resistance (Ron): 10 ohm

The low on-state resistance of 10 ohm ensures minimal signal loss and distortion when passing through the switch, maintaining signal integrity and quality.

Maximum Switch-on Time: 30 ns

The quick switch-on time of 30 ns allows for fast response and signal switching, crucial in time-sensitive applications where minimal delay is desired.

Technical Specifications

Multiplexers & Switches TS3USB31RSER attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

1220 kHz

Maximum Input Voltage:

4.3 V

Minimum Input Voltage:

0 V

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

30 dB

Nominal On-state Resistance Match:

.35 ohm

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Current (Isup):

.001 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

30 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

TS3USB31RSER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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