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TS3USB221ARSERG4

Texas Instruments

TS3USB221ARSERG4 by Texas Instruments

TS3USB221ARSERG4 by Texas Instruments is a 10-terminal chip carrier switch with 2.5V nominal voltage, -40 to 85°C operating temperature range, and 0.6mm max seated height. Ideal for industrial applications requiring a differential multiplexer with 900kHz bandwidth, it features separate outputs, low on-state resistance of 6 ohm, and fast switching times of 50ns on and 23ns off.

Median Price

$0.589

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.589

100+ parts

-

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15

$0.589

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Chip Stock

USA . 108,055 parts In-Stock

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108,055

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Semtec, LLC

USA . 9,001 parts In-Stock

1+ parts

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9,001

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Digiode

USA . 4,712 parts In-Stock

1+ parts

-

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Vyrian

USA . 3,170 parts In-Stock

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3,170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,022 parts In-Stock

1+ parts

$0.245

100+ parts

-

1k+ parts

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3,022

$0.245

-

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Semicontronic

India . 3,071 parts In-Stock

1+ parts

$0.530

100+ parts

$0.517

1k+ parts

$0.514

10k+ parts

-

3,071

$0.530

$0.517

$0.514

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Continental Prestige Electronics

USA . 1,693 parts In-Stock

1+ parts

$0.589

100+ parts

-

1k+ parts

-

10k+ parts

$0.577

1,693

$0.589

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-

$0.577

Argo Parts USA

USA . 1,630 parts In-Stock

1+ parts

$0.589

100+ parts

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1k+ parts

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10k+ parts

$0.571

1,630

$0.589

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$0.571

Corohmni

South Africa . 586 parts In-Stock

1+ parts

$0.589

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586

$0.589

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.607

100+ parts

$0.576

1k+ parts

$0.576

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270

$0.607

$0.576

$0.576

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Parana Technologies

USA . 1,006 parts In-Stock

1+ parts

$9.133

100+ parts

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1k+ parts

$9.783

10k+ parts

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1,006

$9.133

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$9.783

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DigiPath Technology Company

USA . 1,075 parts In-Stock

1+ parts

$10.057

100+ parts

$9.252

1k+ parts

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1,075

$10.057

$9.252

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ChromeModa Solutions

Germany . 1,269 parts In-Stock

1+ parts

$10.262

100+ parts

$8.415

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1,269

$10.262

$8.415

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IDEA Electronic Components Group

UK . 818 parts In-Stock

1+ parts

$10.262

100+ parts

$9.749

1k+ parts

$9.236

10k+ parts

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818

$10.262

$9.749

$9.236

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A-Z Elektronik GmbH

Germany . 6,524 parts In-Stock

1+ parts

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Microchip USA

USA . 1,931 parts In-Stock

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Corphita

USA . 868 parts In-Stock

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868

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Overview

Enhance your electronic designs with the TS3USB221ARSERG4 from Texas Instruments, a leading manufacturer known for delivering top-notch quality products. This multiplexer offers exceptional performance and reliability, making it perfect for a wide range of applications in the electronics industry. With its compact size, low power consumption, and seamless switching capabilities, this chip carrier will bring added value to your projects by ensuring smooth operation and precise signal control. Upgrade your designs today with the TS3USB221ARSERG4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the multiplexer, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a nominal supply voltage of 2.5 V ensures compatibility with a wide range of electronic systems, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this multiplexer can withstand elevated temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the multiplexer can function reliably in cold environments without performance degradation.

Output (V): SEPARATE OUTPUT

Separate output configuration allows for independent signal routing, enhancing flexibility and reducing crosstalk in the system.

Nominal Bandwidth: 900 kHz

High nominal bandwidth of 900 kHz enables rapid signal processing and data transfer rates, making the multiplexer suitable for high-speed applications.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, the multiplexer is compatible with a wide range of power sources, offering flexibility in system design.

Technical Specifications

Multiplexers & Switches TS3USB221ARSERG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

900 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

.2 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Maximum Switch-off Time:

23 ns

Maximum Switch-on Time:

50 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.5 mm

Trade Compliance

TS3USB221ARSERG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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