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STU5N95K5

STMicroelectronics

STU5N95K5 by STMicroelectronics

STU5N95K5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 950V breakdown voltage, 14A max pulsed drain current, and operates at temperatures from -55 °C to 150 °C. Ideal for power management in various electronic devices.

Median Price

$0.342

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$0.342

100+ parts

$0.303

1k+ parts

-

10k+ parts

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50

$0.342

$0.303

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,966 parts In-Stock

1+ parts

$0.401

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-

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4,966

$0.401

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Vyrian

USA . 5,256 parts In-Stock

1+ parts

-

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5,256

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Anansix

USA . 2,180 parts In-Stock

1+ parts

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2,180

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Distributors (Availability)

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Corphita

USA . 2,364 parts In-Stock

1+ parts

$0.380

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-

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2,364

$0.380

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IDEA Electronic Components Group

UK . 928 parts In-Stock

1+ parts

$1.813

100+ parts

-

1k+ parts

$1.632

10k+ parts

-

928

$1.813

-

$1.632

-

MKK Technologies

India . 2,260 parts In-Stock

1+ parts

$3.410

100+ parts

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2,260

$3.410

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DigiPath Technology Company

USA . 2,260 parts In-Stock

1+ parts

$3.410

100+ parts

-

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2,260

$3.410

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Microchip USA

USA . 6,354 parts In-Stock

1+ parts

$5.574

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6,354

$5.574

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$10.950

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737

$10.950

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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18,000

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Epart123

USA . 9,000 parts In-Stock

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$1.080

10k+ parts

$1.080

9,000

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-

$1.080

$1.080

GreenTree Electronics

Israel . 9,000 parts In-Stock

1+ parts

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9,000

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Alle Elektronik GmbH

Germany . 4,252 parts In-Stock

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4,252

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

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$2.168

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177

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$2.168

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Overview

Unlock superior performance with the STU5N95K5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET is engineered for reliability and efficiency, making it ideal for various switching applications. With robust breakdown voltage and enhanced thermal management, it ensures optimal operation even in demanding environments. Choose STMicroelectronics for cutting-edge technology that empowers your designs and elevates your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically have higher efficiency and better performance characteristics compared to P-channel devices, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's functionality by protecting against reverse voltage, which is crucial for switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET effectively handles voltage and current, allowing for efficient signal amplification and control.

Minimum DS Breakdown Voltage: 950 V

A high breakdown voltage of 950V allows the FET to be utilized in demanding applications, providing safety and reliability under high-stress conditions.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy handling, mounting, and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust physical connections, ensuring high reliability in various mounting scenarios and applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control and flexibility in design, offering improved performance in switching applications.

Maximum Pulsed Drain Current (IDM): 14 A

The ability to handle up to 14A of pulsed current ensures the FET can perform in high-demand situations without failure.

Avalanche Energy Rating (EAS): 70 mJ

A high avalanche energy rating allows the FET to withstand transient voltage spikes, increasing its reliability and lifespan in circuits.

No. of Terminals: 3

Having 3 terminals ensures simplicity in circuit design while providing adequate connections for functionality.

Maximum Power Dissipation (Abs): 70 W

The ability to dissipate up to 70W of power allows for effective heat management, enhancing the device's operational lifespan.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient, making it ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides excellent efficiency and fast switching capabilities, making it a top choice for designers.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability in high-heat environments, supporting diverse applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its stability and performance, ensuring efficacy in various applications.

Maximum Turn On Time (ton): 28 ns

A fast turn-on time of 28 ns contributes to high-speed switching applications, improving overall system performance.

Minimum Operating Temperature: -55 °C

This FET can operate in extreme cold conditions (-55 °C), making it suitable for aerospace and military applications.

Maximum Turn Off Time (toff): 57 ns

A quick turn-off time of 57 ns allows for efficient operation in high-frequency environments, enhancing overall circuit performance.

Maximum Drain Current (ID): 3.5 A

A maximum drain current of 3.5 A provides ample power handling capability for various applications.

Maximum Drain-Source On Resistance: 2.5 ohm

A low on-resistance of 2.5 ohms reduces energy loss during operation, leading to better efficiency and cooler operation.

Terminal Position: SINGLE

A single terminal position simplifies connectivity and integration into electronic designs.

Case Connection: DRAIN

Having the drain as the case connection can enhance thermal performance and provide effective heat dissipation.

Maximum Feedback Capacitance (Crss): 1 pF

A low capacitance of 1 pF minimizes delay and signal distortion, making it ideal for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STU5N95K5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1 pF

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

57 ns

Maximum Turn On Time (ton):

28 ns

Trade Compliance

STU5N95K5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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