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STU5N60M2

STMicroelectronics

STU5N60M2 by STMicroelectronics

STU5N60M2 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 14A max pulsed drain current, and operates at temperatures up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,700 parts In-Stock

1+ parts

$1.310

100+ parts

$0.649

1k+ parts

$0.518

10k+ parts

$0.490

2,700

$1.310

$0.649

$0.518

$0.490

DigiKey

USA . 831 parts In-Stock

1+ parts

$1.340

100+ parts

$0.736

1k+ parts

$0.586

10k+ parts

$0.497

831

$1.340

$0.736

$0.586

$0.497

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

$0.437

1k+ parts

-

10k+ parts

-

50

-

$0.437

-

-

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,632 parts In-Stock

1+ parts

$0.437

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

$0.437

-

-

-

Digiode

USA . 1,422 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

$1.244

-

-

-

Anansix

USA . 976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

976

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 846 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$0.371

-

-

-

IDEA Electronic Components Group

UK . 2,051 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

$0.570

10k+ parts

-

2,051

$0.633

-

$0.570

-

Corphita

USA . 2,216 parts In-Stock

1+ parts

$1.179

100+ parts

-

1k+ parts

-

10k+ parts

-

2,216

$1.179

-

-

-

MKK Technologies

India . 1,100 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$1.190

-

-

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$1.190

-

-

-

Microchip USA

USA . 8,092 parts In-Stock

1+ parts

$9.165

100+ parts

-

1k+ parts

-

10k+ parts

-

8,092

$9.165

-

-

-

Perfect Parts

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,780

-

-

-

-

Parana Technologies

USA . 1,776 parts In-Stock

1+ parts

-

100+ parts

$0.757

1k+ parts

-

10k+ parts

-

1,776

-

$0.757

-

-

Alle Elektronik GmbH

Germany . 851 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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851

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Overview

Elevate your projects with the STU5N60M2 from STMicroelectronics, a top-tier N-channel FET designed for superior switching performance. Renowned for its reliability and efficiency, STMicroelectronics ensures that this component delivers exceptional power management in various applications, from industrial controls to consumer electronics. With its robust build and advanced technology, the STU5N60M2 guarantees durability and enhanced functionality, providing unmatched value for your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resilience, making this FET suitable for various applications requiring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and higher efficiency, which enhances the overall performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies design by reducing the number of required components, saving space and increasing reliability.

Transistor Application: SWITCHING

Purpose-built for switching applications, this FET is ideal for use in power management systems, improving efficiency and response times.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures that the transistor can handle substantial voltage levels, making it perfect for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various circuit layouts, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, ensuring reliability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control over conductivity, making this FET suitable for precision applications.

Maximum Pulsed Drain Current (IDM): 14 A

This high pulsed current capability makes the FET suited for applications requiring brief bursts of high current.

Avalanche Energy Rating (EAS): 80 mJ

An avalanche energy rating of 80 mJ indicates robustness against transient conditions, ensuring durability in varied operating environments.

No. of Terminals: 3

The three terminals offer a simple connection scheme, making it easier to design circuits and improve assembly efficiency.

Maximum Power Dissipation (Abs): 45 W

A high power dissipation rating allows the FET to operate effectively without overheating, ensuring reliability during operation.

Package Style (Meter): IN-LINE

The in-line package style facilitates simple mounting and is compatible with standard PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides advantages like low power consumption and high input impedance, contributing to improved performance.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C enhances versatility, allowing the FET to be used in high-temperature environments.

Transistor Element Material: SILICON

Silicon as a material ensures good thermal and electrical performance, making it ideal for a range of applications.

Maximum Turn On Time (ton): 15 ns

A maximum turn-on time of 15 ns enables rapid switching, enhancing performance in high-frequency applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this FET is suitable for extreme environments, ensuring reliable operation.

Maximum Turn Off Time (toff): 85 ns

An 85 ns turn-off time ensures efficient operation, particularly in applications that require quick transitions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent corrosion resistance, enhancing long-term reliability and conductivity.

Maximum Drain Current (ID): 3.5 A

With a maximum drain current of 3.5 A, this FET is capable of handling substantial currents, ensuring effective operation in demanding conditions.

Maximum Drain-Source On Resistance: 1.4 ohm

A low on-resistance facilitates better efficiency and thermal performance, decreasing power loss in the circuit.

Terminal Position: SINGLE

Single terminal positioning simplifies PCB layout and design, providing ease of integration into various applications.

Case Connection: DRAIN

DRAIN case connection allows for a straightforward implementation in common circuit configurations, ensuring ease of use.

Maximum Feedback Capacitance (Crss): 0.75 pF

A low feedback capacitance improves switching performance and reduces the impact of parasitic capacitance in high-speed applications.

Technical Specifications

Power Field Effect Transistors (FET) STU5N60M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.75 pF

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

85 ns

Maximum Turn On Time (ton):

15 ns

Trade Compliance

STU5N60M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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