Loading...

STU5N95K3

STMicroelectronics

STU5N95K3 by STMicroelectronics

STU5N95K3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 950V breakdown voltage, 4A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 107,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107,475

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 69,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,580

-

-

-

-

Vyrian

USA . 7,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,360

-

-

-

-

Digiode

USA . 2,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,814

-

-

-

-

Anansix

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,266

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,037 parts In-Stock

1+ parts

$0.755

100+ parts

-

1k+ parts

$0.680

10k+ parts

-

2,037

$0.755

-

$0.680

-

MKK Technologies

India . 706 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$1.420

-

-

-

DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$1.420

-

-

-

AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$14.740

100+ parts

-

1k+ parts

-

10k+ parts

-

1,116

$14.740

-

-

-

Microchip USA

USA . 4,148 parts In-Stock

1+ parts

$18.655

100+ parts

-

1k+ parts

-

10k+ parts

-

4,148

$18.655

-

-

-

Kepictronics

USA . 600,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600,000

-

-

-

-

Epart123

USA . 434,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.313

434,850

-

-

-

$0.313

iodParts Technologies Inc.

India . 434,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

434,850

-

-

-

-

GreenTree Electronics

Israel . 434,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

434,850

-

-

-

-

Authorized Procurement Solutions

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,000

-

-

-

-

Eastek

USA . 48,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48,980

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,298

-

-

-

-

Alle Elektronik GmbH

Germany . 3,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,649

-

-

-

-

Perfect Parts

USA . 3,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,633

-

-

-

-

Corphita

USA . 3,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,573

-

-

-

-

Parana Technologies

USA . 624 parts In-Stock

1+ parts

-

100+ parts

$0.903

1k+ parts

-

10k+ parts

-

624

-

$0.903

-

-

Overview

Unlock unparalleled performance with the STU5N95K3 from STMicroelectronics, a premier choice for power applications. Designed for efficiency and reliability, this N-channel FET excels in switching applications, delivering robust current handling and impressive voltage ratings. With STMicroelectronics' renowned quality assurance, you can trust that your projects will benefit from enhanced durability and superior functionality, making it an invaluable asset in industrial and consumer electronics alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and cost-effectiveness, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-state resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit designs and enhances protection against reverse voltage, ensuring reliable operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient operation in various power management tasks.

Minimum DS Breakdown Voltage: 950 V

A high breakdown voltage allows for safe operation in high-voltage environments, providing versatility in industrial applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, allowing for efficient layout and integration into compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and easy soldering, ensuring reliable connections in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and faster switching times, making this FET suitable for high-performance circuits.

Maximum Pulsed Drain Current (IDM): 16 A

The capability to handle pulsed currents up to 16 A makes this FET suitable for handling dynamic loads and transient conditions.

Avalanche Energy Rating (EAS): 100 mJ

A high avalanche energy rating indicates robustness against voltage spikes, enhancing reliability in demanding environments.

Maximum Drain Current (Abs) (ID): 4 A

This FET can handle a maximum continuous drain current of 4 A, suitable for many low to mid-power applications.

No. of Terminals: 3

Having three terminals simplifies circuit designs while providing adequate functionality for a variety of applications.

Maximum Power Dissipation (Abs): 90 W

With a maximum power dissipation of 90 W, this FET can effectively manage heat, ensuring reliable operation during high-load conditions.

Package Style (Meter): IN-LINE

An in-line package style is beneficial for space-efficient layouts, making it easier to integrate into various designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, allowing for efficient switching and signal processing.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enhances reliability in harsh environments, making this FET suitable for industrial applications.

Transistor Element Material: SILICON

Silicon material ensures good thermal stability and performance, making it a standard choice for reliable electronic components.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain-Source On Resistance: 3.5 ohm

Low on-resistance provides efficient performance with minimal power loss, making it ideal for energy-sensitive applications.

Terminal Position: SINGLE

A single terminal position streamlines integration into circuits, making the FET easy to use in various designs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for compatibility with modern automated PCB assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness against thermal stresses during assembly, ensuring a reliable product.

Technical Specifications

Power Field Effect Transistors (FET) STU5N95K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU5N95K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 9