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STS5NS150

STMicroelectronics

STS5NS150 by STMicroelectronics

STS5NS150 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 5 A, a breakdown voltage of 150 V, and operates at up to 150 °C. Ideal for compact designs with its surface mount configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,859 parts In-Stock

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3,859

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Vyrian

USA . 3,581 parts In-Stock

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3,581

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Anansix

USA . 1,216 parts In-Stock

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1,216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

$1.418

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1,411

$1.575

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$1.418

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MKK Technologies

India . 1,792 parts In-Stock

1+ parts

$2.962

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1,792

$2.962

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DigiPath Technology Company

USA . 1,792 parts In-Stock

1+ parts

$2.962

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1,792

$2.962

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Corphita

USA . 1,765 parts In-Stock

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1,765

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Parana Technologies

USA . 620 parts In-Stock

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$1.883

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620

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$1.883

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Overview

Unlock the power of efficiency with the STS5NS150 from STMicroelectronics, your go-to solution for reliable switching applications! This high-quality N-channel FET delivers outstanding performance in compact designs, ensuring optimal energy management. With a robust breakdown voltage and built-in diode, it enhances system reliability while saving space. Trust STMicroelectronics' expertise to elevate your projects, maximizing value and performance effortlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and resistance to moisture, making the FET suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is ideal for high-speed switching applications, allowing for efficient operation in a variety of circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against voltage spikes, enhancing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is capable of handling fast switching speeds, suitable for modern electronic designs.

Surface Mount: YES

Surface mount technology allows for compact design and space-saving installations, making it perfect for high-density circuits.

Minimum DS Breakdown Voltage: 150 V

A minimum breakdown voltage of 150V ensures that the FET can handle higher voltages, providing increased safety and reliability.

Package Shape: RECTANGULAR

The rectangular package shape accommodates efficient layout in PCB designs, allowing for optimized circuit performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical stability of the FET during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the device conduction, ensuring low power loss and high efficiency.

Maximum Pulsed Drain Current (IDM): 20 A

The ability to handle pulsed drain currents up to 20A makes this FET suitable for applications requiring high current management.

Avalanche Energy Rating (EAS): 500 mJ

A high avalanche energy rating indicates robustness against transient conditions, making the device reliable in harsh environments.

Maximum Drain Current (Abs) (ID): 5 A

This FET’s capability of a maximum drain current of 5A ensures effective control in various switching applications.

No. of Terminals: 8

With 8 terminals, this FET offers multiple connection options, providing flexibility for circuit design.

Maximum Power Dissipation (Abs): 2.5 W

A maximum power dissipation of 2.5W allows for efficient thermal management in the FET, enhancing performance and lifespan.

Package Style (Meter): SMALL OUTLINE

The small outline package style leads to reduced footprint and enables space-efficient designs in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and rapid switching capabilities, making this FET a strong choice for modern circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliable operation in demanding applications and environments.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties and stability, making it a reliable choice for power applications.

Maximum Drain Current (ID): 5 A

The ability to support a maximum drain current of 5A enhances the versatility for various applications requiring efficient power control.

Maximum Drain-Source On Resistance: 0.1 ohm

A low on-resistance of 0.1 ohm ensures minimal power loss during operation, improving overall efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position provides better connectivity options and stable mounting, ensuring reliable circuit performance.

Technical Specifications

Power Field Effect Transistors (FET) STS5NS150 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS5NS150 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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