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STS5DNF20V

STMicroelectronics

STS5DNF20V by STMicroelectronics

STS5DNF20V by STMicroelectronics is an N-CHANNEL FET with 20V DS Breakdown Voltage and 5A Drain Current. Ideal for SWITCHING applications, it features a dual-element configuration with built-in diode, GULL WING terminals, and operates in ENHANCEMENT MODE.

Median Price

$1.048

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 307 parts In-Stock

1+ parts

$0.220

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307

$0.220

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Bristol Electronics

USA . 5,507 parts In-Stock

1+ parts

$1.875

100+ parts

$0.694

1k+ parts

$0.487

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5,507

$1.875

$0.694

$0.487

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Vyrian

USA . 5,080 parts In-Stock

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5,080

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Dan-Mar Components

USA . 3,152 parts In-Stock

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Lakeland Logistics Inc

USA . 2,500 parts In-Stock

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2,500

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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Microfarads

USA . 2,270 parts In-Stock

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2,270

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Semi Source

USA . 2,181 parts In-Stock

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2,181

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Digiode

USA . 2,181 parts In-Stock

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Anansix

USA . 672 parts In-Stock

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672

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R&J Components

USA . 190 parts In-Stock

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Atlantic Semiconductor

USA . 150 parts In-Stock

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150

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PC Components Company LLC

USA . 35 parts In-Stock

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35

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Prism Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$0.431

100+ parts

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1k+ parts

$0.388

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1,542

$0.431

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$0.388

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MKK Technologies

India . 1,224 parts In-Stock

1+ parts

$0.810

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1,224

$0.810

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DigiPath Technology Company

USA . 1,224 parts In-Stock

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$0.810

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1,224

$0.810

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AZTECH Wire

Italy . 788 parts In-Stock

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$20.090

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788

$20.090

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RC Electronics

USA . 65,000 parts In-Stock

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Kepictronics

USA . 21,250 parts In-Stock

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Perfect Parts

USA . 13,402 parts In-Stock

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Authorized Procurement Solutions

USA . 6,807 parts In-Stock

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GreenTree Electronics

Israel . 6,807 parts In-Stock

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Parana Technologies

USA . 2,185 parts In-Stock

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$0.515

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$0.515

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A-Z Elektronik GmbH

Germany . 1,917 parts In-Stock

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Corphita

USA . 1,302 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Elevate your power management solutions with the STS5DNF20V by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers seamless switching capabilities in a compact and durable package. Ideal for a wide range of applications, this transistor delivers reliable performance with a maximum drain current of 5A and a minimum DS breakdown voltage of 20V. Trust in STMicroelectronics to bring you cutting-edge technology that enhances efficiency and performance in your projects. Upgrade to the STS5DNF20V and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for applications where weight and reliability are important.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current-carrying capacity compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode helps in preventing reverse current flow, providing added protection to the circuit. Having separate elements allows for more flexibility in circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-resistance, making it efficient and suitable for various power management tasks.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated into compact PCB designs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage of 20 V ensures that the FET can handle voltage spikes and fluctuations without getting damaged, making it reliable for use in various circuit protection applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and routing on a PCB, optimizing space utilization and facilitating easier board design.

Terminal Form: GULL WING

The gull-wing terminals provide high mechanical strength and ease of soldering, ensuring a reliable electrical connection in the circuit.

Operating Mode: ENHANCEMENT MODE

Being an enhancement mode FET means that it requires a positive voltage at the gate to turn on, offering better control over the switching operation and reducing the risk of accidental activation.

No. of Elements: 2

Having two separate elements allows for more complex circuit designs and increased versatility in power management applications.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current rating of 20 A ensures that the FET can handle short-duration high current loads without overheating or failing, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 5 A

The maximum continuous drain current rating of 5 A indicates the FET's ability to handle moderate current loads reliably over an extended period, making it ideal for various power control tasks.

No. of Terminals: 8

Having 8 terminals allows for multiple connection options and facilitates more complex circuit configurations, offering greater design flexibility.

Maximum Power Dissipation (Abs): 2 W

The maximum power dissipation rating of 2 W indicates the FET's ability to dissipate heat effectively, ensuring stable operation under high power conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronics applications where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance, low ON-resistance, and fast switching speeds, making the FET efficient and reliable for various power management tasks.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures that the FET can withstand elevated temperatures without malfunctioning, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency, ensuring stable performance and long-term durability of the FET.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides good corrosion resistance and reliable soldering connections, ensuring long-term stability and performance of the FET in various environmental conditions.

Maximum Drain Current (ID): 5 A

The maximum drain current rating of 5 A indicates the FET's ability to handle moderate current loads reliably over an extended period, making it suitable for various power control tasks.

Maximum Drain-Source On Resistance: 0.045 ohm

The low ON-resistance of 0.045 ohms reduces power losses and improves efficiency in power switching applications, making the FET a reliable choice for high-performance circuits.

Terminal Position: DUAL

Having dual terminal positions allows for versatile mounting options and easy integration into different circuit layouts, providing flexibility in design and installation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the FET can withstand the reflow soldering process without damage, making it easy to integrate into automated assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C indicates the FET's ability to withstand the reflow soldering process without deformation or damage, ensuring reliable solder joints and long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) STS5DNF20V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS5DNF20V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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