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STS5N15M3

STMicroelectronics

STS5N15M3 by STMicroelectronics

STS5N15M3 by STMicroelectronics is an N-channel FET ideal for switching applications. It features a 150V breakdown voltage, 18A max pulsed drain current, and operates at up to 150 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,083 parts In-Stock

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4,083

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Vyrian

USA . 1,412 parts In-Stock

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1,412

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Anansix

USA . 775 parts In-Stock

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775

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$0.449

100+ parts

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1k+ parts

$0.404

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1,320

$0.449

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$0.404

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MKK Technologies

India . 1,736 parts In-Stock

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$0.844

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1,736

$0.844

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DigiPath Technology Company

USA . 1,736 parts In-Stock

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$0.844

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1,736

$0.844

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Kepictronics

USA . 5,045 parts In-Stock

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5,045

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Corphita

USA . 4,438 parts In-Stock

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4,438

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Parana Technologies

USA . 444 parts In-Stock

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$0.537

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444

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$0.537

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Overview

Unlock the power of efficiency with the STS5N15M3 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel Power FET is designed for seamless switching applications, boasting exceptional reliability and durability. With its compact design and built-in diode, it streamlines your circuit designs while optimizing power management. Elevate your projects with ST's trusted quality, ensuring long-lasting performance and impressive value for any application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight construction and provides good insulation properties, making the FET suitable for a variety of electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher conductivity and are generally preferred for their efficiency in many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against back EMF, making it ideal for applications where inductive loads are present.

Transistor Application: SWITCHING

Optimized for switching, this FET is perfect for applications like power management where fast response times are crucial.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards, making assembly efficient.

Minimum DS Breakdown Voltage: 150 V

A breakdown voltage of 150V allows this FET to be used in applications that require handling high voltages safely.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and enables easier alignment during assembly processes.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and reliable mechanical connections, enhancing durability in harsh environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high flexibility in design and control, enabling better performance in various applications.

Maximum Pulsed Drain Current (IDM): 18 A

This high pulsed drain current capability makes the FET suitable for applications that require brief, high current surges.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5A highlights the FET's utility in medium-power applications where performance is balanced with size.

No. of Terminals: 8

Having 8 terminals provides flexibility for complex connections, enabling versatile circuit designs.

Maximum Power Dissipation (Abs): 2.5 W

The ability to dissipate 2.5W is essential for maintaining thermal stability in high-current applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to overall design compactness, making it ideal for densely populated circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides fast switching speeds and high efficiency, enhancing overall circuit performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can sustain performance in high-temp environments, enhancing reliability.

Transistor Element Material: SILICON

The use of silicon as the element material ensures good thermal performance, chemical stability, and excellent electrical characteristics.

Maximum Drain Current (ID): 4.5 A

With a maximum drain current of 4.5A, the FET offers robust performance suitable for various power applications.

Maximum Drain-Source On Resistance: 0.057 ohm

A low on-resistance of 0.057 ohms allows for minimal power loss during operation, improving overall energy efficiency.

Terminal Position: DUAL

Dual terminal positioning makes this FET easier to integrate into diverse layouts and provides flexibility in circuit design.

Technical Specifications

Power Field Effect Transistors (FET) STS5N15M3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS5N15M3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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