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STS5PF20V

STMicroelectronics

STS5PF20V by STMicroelectronics

STS5PF20V from STMicroelectronics is a P-channel FET designed for efficient switching applications. It features a max drain current of 5 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Ideal for compact electronic designs with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,623 parts In-Stock

1+ parts

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5,623

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Digiode

USA . 2,270 parts In-Stock

1+ parts

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2,270

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Anansix

USA . 1,524 parts In-Stock

1+ parts

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1,524

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

$0.850

10k+ parts

-

2,210

$0.944

-

$0.850

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MKK Technologies

India . 244 parts In-Stock

1+ parts

$1.775

100+ parts

-

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244

$1.775

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DigiPath Technology Company

USA . 244 parts In-Stock

1+ parts

$1.775

100+ parts

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244

$1.775

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AZTECH Wire

Italy . 1,112 parts In-Stock

1+ parts

$16.170

100+ parts

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1,112

$16.170

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Alle Elektronik GmbH

Germany . 3,843 parts In-Stock

1+ parts

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3,843

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Corphita

USA . 1,706 parts In-Stock

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1,706

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Perfect Parts

USA . 693 parts In-Stock

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693

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Parana Technologies

USA . 148 parts In-Stock

1+ parts

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$1.129

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148

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$1.129

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Overview

Unlock superior performance with the STS5PF20V from STMicroelectronics—a trusted leader in semiconductor technology. This P-channel Power FET promises remarkable efficiency, ideal for reliable switching applications. Its robust design ensures durability, while its compact size makes it perfect for space-constrained projects. Experience enhanced thermal management and reduced power loss, empowering your innovations with quality you can rely on. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures lightweight construction and cost-effective manufacturing, enhancing durability and reliability.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration allows for easier integration in high-side switching applications, which can simplify overall circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

This design feature provides improved protection against voltage spikes, making the FET suitable for switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this product can efficiently control power in various electronic circuits, offering lower loss and improved efficiency.

Surface Mount: YES

Being surface mount compatible allows for lower profile designs and easier automation in assembly processes, reducing production time and costs.

Minimum DS Breakdown Voltage: 20 V

A breakdown voltage of 20 V provides a safe margin for operation in various applications, ensuring reliability even when exposed to unexpected voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space within electronic designs, allowing for more efficient PCB layouts.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure a secure connection to the PCB, enhancing mechanical stability.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation provides a normally-off FET, leading to better control and efficiency in power management applications.

Maximum Pulsed Drain Current (IDM): 20 A

A high pulsed drain current claim of 20 A indicates robust performance in demanding applications, capable of handling transient conditions.

Maximum Drain Current (Abs) (ID): 5 A

Rated at 5 A for absolute maximum drain current ensures reliability in standard operating conditions while protecting the device from excess current.

No. of Terminals: 8

The 8-terminal configuration allows for additional functions within a compact footprint, contributing to versatile circuit designs.

Maximum Power Dissipation (Abs): 2.5 W

With a maximum power dissipation of 2.5 W, the FET can operate efficiently under load, helping to minimize overheating and improve longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports compact designs, ideal for modern electronics which prioritize space and efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology provides high-speed switching capabilities and greater efficiency, beneficial for power management.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for usage in high-temperature environments, enhancing design options in various applications.

Transistor Element Material: SILICON

Silicon is a proven semiconductor material providing excellent electrical performance, making this FET reliable in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring long-term reliable connections.

Maximum Drain Current (ID): 5 A

With a maximum rating of 5 A, this FET offers a solid balance between performance and thermal management in multiple applications.

Maximum Drain-Source On Resistance: 0.1 ohm

A low on-resistance of 0.1 ohm results in minimal power loss during operation, improving the overall efficiency of power circuits.

Terminal Position: DUAL

The dual terminal position improves layout flexibility for circuit designers, allowing for more compact and efficient PCB design.

Technical Specifications

Power Field Effect Transistors (FET) STS5PF20V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS5PF20V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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