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STS5N150

STMicroelectronics

STS5N150 by STMicroelectronics

STS5N150 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 150V breakdown voltage, 5A max drain current, and a low on-resistance of 0.06Ω. Ideal for power management in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,272 parts In-Stock

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Anansix

USA . 510 parts In-Stock

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510

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Vyrian

USA . 196 parts In-Stock

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

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$1.714

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$1.543

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2,209

$1.714

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$1.543

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MKK Technologies

India . 464 parts In-Stock

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$3.223

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DigiPath Technology Company

USA . 464 parts In-Stock

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$3.223

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464

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Corphita

USA . 3,202 parts In-Stock

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Parana Technologies

USA . 121 parts In-Stock

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$2.049

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Overview

Unlock the power of efficiency with the STS5N150 from STMicroelectronics. This high-quality N-channel Power FET is designed for seamless switching applications, delivering exceptional performance in a compact package. With a robust design and built-in diode, it ensures reliability in demanding environments. Trust STMicroelectronics for innovative solutions that elevate your projects, offering unmatched value and long-term benefits for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and thermal performance, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer higher efficiency and better performance in switching applications compared to P-channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by reducing component count, which can enhance reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET ensures fast operation, making it ideal for power management and control.

Surface Mount: YES

Surface mount packaging allows for automated assembly, reducing manufacturing costs and improving performance in compact electronic designs.

Minimum DS Breakdown Voltage: 150 V

A high breakdown voltage ensures robustness, allowing the FET to operate safely in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular shape is optimal for space-efficient layouts and facilitates easier integration into various circuit configurations.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering reliability, ensuring better electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in the off state, making this FET energy-efficient.

Maximum Pulsed Drain Current (IDM): 20 A

A high pulsed current capability allows this FET to handle significant inrush currents, beneficial for applications with peak demands.

Maximum Drain Current (Abs) (ID): 5 A

This rating indicates reliable performance under continuous operation, ensuring device longevity in challenging applications.

No. of Terminals: 8

Multiple terminals provide flexibility in circuit design, allowing for various configurations and improved connectivity.

Maximum Power Dissipation (Abs): 2.5 W

This power dissipation rating indicates the ability to operate without overheating, enhancing reliability in practical use.

Package Style (Meter): SMALL OUTLINE

A small outline package supports compact designs, making this FET suitable for modern, space-constrained electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for fast switching speeds and high input impedance, which are essential for high-performance applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability and stability even in demanding thermal environments.

Transistor Element Material: SILICON

Silicon is the most widely used material for FETs, known for its reliability and performance characteristics in switching applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and enhances solderability, ensuring long-term reliability of the connections.

Maximum Drain Current (ID): 5 A

With a maximum drain current rating of 5 A, the FET ensures strong operational capability for various applications.

Maximum Drain-Source On Resistance: 0.06 ohm

Low on-resistance minimizes power losses during operation, improving overall system efficiency.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility, making it easier to incorporate into diverse circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STS5N150 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS5N150 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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