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STR755FV0T6

STMicroelectronics

STR755FV0T6 by STMicroelectronics

STR755FV0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, 16 ADC channels, and supports various connectivity options like I2C and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,767 parts In-Stock

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5,767

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Digiode

USA . 2,081 parts In-Stock

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2,081

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Anansix

USA . 1,469 parts In-Stock

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1,469

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R&J Components

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$13.450

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792

$13.450

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Microchip USA

USA . 243 parts In-Stock

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$14.594

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243

$14.594

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IDEA Electronic Components Group

UK . 696 parts In-Stock

1+ parts

$61.838

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$55.654

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696

$61.838

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$55.654

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MKK Technologies

India . 709 parts In-Stock

1+ parts

$116.282

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709

$116.282

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DigiPath Technology Company

USA . 709 parts In-Stock

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$116.282

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709

$116.282

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A-Z Elektronik GmbH

Germany . 6,081 parts In-Stock

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6,081

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,354 parts In-Stock

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3,354

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Parana Technologies

USA . 2,300 parts In-Stock

1+ parts

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$73.936

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2,300

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$73.936

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Perfect Parts

USA . 1,779 parts In-Stock

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1,779

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Overview

Unlock the potential of your next project with the STR755FV0T6 microcontroller from STMicroelectronics, a beacon of reliability and innovation. This 32-bit powerhouse is designed for versatility, seamlessly integrating into diverse applications while delivering exceptional performance. With advanced features like multiple communication interfaces and robust peripherals, it ensures efficiency and effectiveness in automation, industrial control, and consumer electronics. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for compact designs and lower profiles, ideal for modern electronic products.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage enhances compatibility with various systems while maintaining operational safety.

Package Shape: SQUARE

The square shape optimizes space utilization on PCBs, making it a good fit for high-density circuits.

Bit Size: 32

A 32-bit architecture provides the ability to process complex instructions and handle large data sets efficiently.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V supplies allows flexibility in design choices and compatibility with various components.

No. of Terminals: 100

A larger number of terminals facilitates connectivity, providing more I/O options for versatile applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style contributes to lower profile designs and fine pitch layout, essential for compact devices.

Minimum Supply Voltage: 4.5 V

A relatively low minimum supply voltage enhances energy efficiency without compromising performance.

Maximum Operating Temperature: 85 °C

Ability to operate at higher temperatures makes it reliable for industrial applications where thermal conditions fluctuate.

CPU Family: ARM7

The ARM7 family is known for its efficiency and performance, making it suitable for a range of processing tasks.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures functionality in extreme environments, ideal for industrial and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and reliability in electrical connections.

ADC Channels: YES

The presence of ADC channels enables analog signal processing, increasing the microcontroller’s versatility.

DMA Channels: YES

DMA channels allow for efficient data transfers, enhancing performance by offloading tasks from the CPU.

Terminal Position: QUAD

Quad terminal position enhances connectivity options, ensuring good space efficiency on devices.

ROM Words: 65536

A large ROM size provides ample space for firmware storage, enabling more complex functionalities.

Maximum Seated Height: 1.6 mm

Low seated height is ideal for compact designs, allowing devices to maintain a slim profile.

Width: 14 mm

Compact width aids in fitting the microcontroller into space-constrained designs.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

A rich set of peripherals supports a variety of applications, from motor control to real-time processing.

Maximum Clock Frequency: 60 MHz

60 MHz clock frequency enables processing of complex tasks, making it efficient for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate tolerance for peak reflow temperatures ensures reliability during manufacturing processes.

Peak Reflow Temperature °C: 250

Ability to withstand high temperatures enhances manufacturing flexibility and reduces thermal damage risk.

Length: 14 mm

Compact length is suitable for small form factor designs, contributing to overall product miniaturization.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture leads to lower power consumption while maintaining high performance, ideal for battery-operated devices.

RAM Bytes: 16384

Adequate RAM size supports efficient data handling for complex applications and multitasking.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-sensitive designs.

Terminal Form: GULL WING

Gull wing terminals enhance soldering and assembly processes, facilitating reliable connections.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel ADCs with 10-bit resolution offer versatile analog interfacing, broadening application potential.

Nominal Supply Voltage: 5 V

A common nominal supply voltage simplifies design integration across various components and systems.

PWM Channels: YES

PWM channels enable precise control over actuators and motors, making it ideal for robotics and automation.

Connectivity: I2C, LIN, SPI(2), UART(3)

Multiple communication interfaces enhance connectivity options, allowing for integration with diverse peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density layouts, essential for modern compact circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring precautions can be easily managed during production.

Speed: 48 rpm

This speed rating can be useful in applications like motor control, offering flexibility in operational performance.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient data storage and programming dynamics, catering to a variety of needs.

No. of I/O Lines: 72

With 72 I/O lines, this microcontroller supports extensive interfacing capabilities, making it adaptable to various applications.

Technical Specifications

Microcontrollers STR755FV0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR755FV0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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