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STR755FR1T6

STMicroelectronics

STR755FR1T6 by STMicroelectronics

STR755FR1T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, 11 ADC channels, and supports I2C, SPI, and UART for versatile applications in industrial automation. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,130 parts In-Stock

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2,130

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Vyrian

USA . 1,922 parts In-Stock

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1,922

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Digiode

USA . 1,227 parts In-Stock

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1,227

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Distributors (Availability)

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AZTECH Wire

Italy . 1,177 parts In-Stock

1+ parts

$8.240

100+ parts

-

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1,177

$8.240

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Microchip USA

USA . 284 parts In-Stock

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$8.781

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284

$8.781

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IDEA Electronic Components Group

UK . 900 parts In-Stock

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$63.431

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$57.088

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900

$63.431

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$57.088

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Component Stockers USA

USA . 583 parts In-Stock

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$99.990

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583

$99.990

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MKK Technologies

India . 1,828 parts In-Stock

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$119.278

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1,828

$119.278

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DigiPath Technology Company

USA . 1,828 parts In-Stock

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$119.278

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1,828

$119.278

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 6,341 parts In-Stock

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6,341

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 150 parts In-Stock

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$75.842

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150

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$75.842

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Corphita

USA . 94 parts In-Stock

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94

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Overview

Unlock the power of innovation with the STR755FR1T6 microcontroller from STMicroelectronics! Renowned for quality and reliability, STMicroelectronics equips your projects with advanced features and robust performance, ideal for automation, industrial control, and IoT applications. Experience seamless connectivity, enhanced processing capabilities, and low power consumption, all packaged in a compact design. Elevate your designs with a trusted partner—where excellence meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliable performance and resistance to environmental stressors.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes it compatible with a broad range of power supply circuits.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on the PCB.

Bit Size: 32

A 32-bit architecture supports advanced processing capabilities, making it suitable for complex applications.

Power Supplies (V): 3.3/5

Dual power supply options (3.3V and 5V) provide versatility for various applications and devices.

No. of Terminals: 64

With 64 terminals, the microcontroller offers numerous I/O options for extensive connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design minimizes height, making it ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for flexible power requirements and low energy consumption.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes this product suitable for industrial applications.

CPU Family: ARM7

The ARM7 CPU family provides high performance and efficiency, well-suited for a variety of applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold temperatures (-40 °C) ensures reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the strength and durability of the connections.

ADC Channels: YES

Integrated ADC channels provide the capability to handle analog signals, making it versatile for sensor applications.

DMA Channels: YES

DMA support allows for data transfer without CPU intervention, enhancing performance and efficiency.

Terminal Position: QUAD

Quad terminal positioning optimizes space on the PCB and allows for easier routing.

ROM Words: 131072

With 131072 ROM words, the microcontroller can accommodate substantial code storage needs.

Maximum Seated Height: 1.6 mm

Low seated height promotes compact design, which is crucial for portable and advanced electronic devices.

Width: 10 mm

Having a width of 10 mm ensures it fits well within various design configurations.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

A rich set of peripherals enhances functionality and allows for complex control systems.

Maximum Clock Frequency: 60 MHz

The maximum clock frequency of 60 MHz supports high-speed processing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with modern soldering techniques and PCB assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust assembly processes without damage.

Length: 10 mm

10 mm length enables compact integration into small electronics while providing sufficient functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in various temperature-sensitive operations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller improves processing efficiency, making it well-suited for real-time applications.

RAM Bytes: 16384

With 16384 bytes of RAM, it provides ample memory for executing complex algorithms and functions.

Technology: CMOS

CMOS technology ensures low power consumption and a high level of integration, beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form improves solderability and provides reliable electrical connections.

Analog To Digital Convertors: 11-Ch 10-Bit

The inclusion of 11-channel 10-bit ADCs allows for precise digital representation of analog signals.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with many standard digital systems, ensuring easy integration.

PWM Channels: YES

Support for PWM channels enables effective motor control and signal modulation for various applications.

Connectivity: I2C, LIN, SPI(2), UART(3)

Diverse connectivity options facilitate easy integration into different systems and enhance communication capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing product longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a denser design, making it suitable for modern electronics.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good handling and storage practices, offering peace of mind during manufacturing.

Speed: 48 rpm

Operates efficiently at 48 rpm, suitable for various timing and control operations.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient coding practices and compatibility with various programming languages.

No. of I/O Lines: 38

With 38 I/O lines available, the microcontroller is versatile for a wide range of input/output applications.

Technical Specifications

Microcontrollers STR755FR1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR755FR1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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