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STR755FR0T6

STMicroelectronics

STR755FR0T6 by STMicroelectronics

STR755FR0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C range. It features 64 terminals, 11 ADC channels, and supports I2C, SPI, and UART for versatile applications in industrial automation. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,629 parts In-Stock

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Digiode

USA . 2,890 parts In-Stock

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2,890

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Anansix

USA . 306 parts In-Stock

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306

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Microchip USA

USA . 170 parts In-Stock

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$9.189

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170

$9.189

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AZTECH Wire

Italy . 920 parts In-Stock

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$10.230

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920

$10.230

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IDEA Electronic Components Group

UK . 1,987 parts In-Stock

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$24.361

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$21.925

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1,987

$24.361

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$21.925

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MKK Technologies

India . 133 parts In-Stock

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$45.809

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133

$45.809

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DigiPath Technology Company

USA . 133 parts In-Stock

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$45.809

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$45.809

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QUARKTWIN TECHNOLOGY LTD

USA . 27,140 parts In-Stock

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Corphita

USA . 4,737 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,017 parts In-Stock

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3,017

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Parana Technologies

USA . 2,098 parts In-Stock

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$29.127

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2,098

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$29.127

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Metaverse IC Inc.

Canada . 1,964 parts In-Stock

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Overview

Elevate your projects with the STR755FR0T6 microcontroller from STMicroelectronics—where innovation meets reliability. Designed for diverse applications, this ARM7-based powerhouse ensures seamless performance in industrial environments, offering low power consumption and robust features. Enjoy unmatched quality and support from a trusted leader in semiconductor solutions. Unlock new potential with precision control, versatile connectivity, and an easy integration process that empowers your creativity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and ease of integration into modern PCBs, enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

The wide voltage range supports various applications and simplifies power supply designs.

Package Shape: SQUARE

The square package shape facilitates efficient thermal management and layout optimization in PCB designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, suitable for complex applications.

Power Supplies (V): 3.3/5

Dual power supply options allow for compatibility with different system voltages, increasing versatility.

No. of Terminals: 64

A higher number of terminals provides greater connectivity options for various peripherals, enhancing system capability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design minimizes space requirements in compact applications, making it ideal for modern electronics.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement ensures stable operation in a range of environments, increasing reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can be used in demanding environments without performance degradation.

CPU Family: ARM7

ARM7 architecture is known for its efficiency and performance in handling instruction sets, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to operate in harsh environments, ideal for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures good conductivity and protects against wear, enhancing reliability and longevity.

ADC Channels: YES

The presence of ADC channels allows for easy integration of analog signals, enabling advanced sensor applications.

DMA Channels: YES

DMA channels improve data transfer efficiency by offloading data handling from the CPU, improving overall system performance.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and layout on PCBs, enhancing design flexibility.

ROM Words: 65536

A substantial ROM allows for complex program storage, enabling sophisticated applications.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for compact designs, contributing to slimmer electronics.

Width: 10 mm

The 10 mm width makes it suitable for space-constrained designs while providing sufficient terminals.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Diverse peripheral support provides extensive functionality for various systems, making it versatile for many applications.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz ensures fast processing, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification is critical for compatibility with standard surface mount assembly processes, ensuring reliable solder joints.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature indicates robustness during soldering, enhancing assembly reliability.

Length: 10 mm

The compact length allows for space-efficient designs in various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robust performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes performance per watt, making it efficient for embedded applications.

RAM Bytes: 16384

Ample RAM supports complex applications and multitasking, increasing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are suitable for conventional soldering methods, ensuring ease of assembly.

Analog To Digital Converters: 11-Ch 10-Bit

A high number of ADC channels enhances flexibility in handling multiple analog inputs, which is crucial for sensor applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns well with common power supplies, simplifying designs.

PWM Channels: YES

PWM channels enable effective motor control and signal modulation applications, enhancing functionality.

Connectivity: I2C, LIN, SPI(2), UART(3)

Multiple connectivity options ensure compatibility with a wide range of peripherals and communication standards.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in code changes, ideal for development and production.

Terminal Pitch: 0.5 mm

Fine pitch design maximizes the number of connections in a compact space, optimizing PCB layout.

Moisture Sensitivity Level (MSL): 3

ML Level 3 indicates moderate sensitivity, meaning appropriate handling precautions are required to ensure reliability during production.

Speed: 48 rpm

Moderate speed allows it to be utilized effectively in control applications such as motors or robotics.

On Chip Program ROM Width: 8

A standard ROM width allows for compatibility with a wide range of programming tools and development environments.

No. of I/O Lines: 38

A generous number of I/O lines allows for extensive interfacing and control in various applications.

Technical Specifications

Microcontrollers STR755FR0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR755FR0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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