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STR752FR2T7

STMicroelectronics

STR752FR2T7 by STMicroelectronics

STR752FR2T7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 105 °C. It features 64 terminals, supports CAN/I2C/SPI/UART connectivity, and includes ADC/DMA capabilities. Ideal for industrial applications, it offers robust performance with up to 60 MHz clock speed.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,906 parts In-Stock

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6,906

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Anansix

USA . 2,650 parts In-Stock

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2,650

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Digiode

USA . 1,113 parts In-Stock

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1,113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 457 parts In-Stock

1+ parts

$8.576

100+ parts

-

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-

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457

$8.576

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AZTECH Wire

Italy . 140 parts In-Stock

1+ parts

$12.410

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140

$12.410

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

1+ parts

$14.024

100+ parts

-

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$12.621

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1,863

$14.024

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$12.621

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MKK Technologies

India . 796 parts In-Stock

1+ parts

$26.370

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796

$26.370

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DigiPath Technology Company

USA . 796 parts In-Stock

1+ parts

$26.370

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796

$26.370

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Corphita

USA . 1,452 parts In-Stock

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1,452

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Parana Technologies

USA . 389 parts In-Stock

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$16.767

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389

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$16.767

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Overview

Experience unrivaled performance with the STR752FR2T7 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for versatility, this robust ARM7-based solution excels in industrial applications, offering exceptional reliability and efficiency. With advanced features like multiple connectivity options and integrated peripherals, it empowers engineers to create innovative designs, streamline processes, and reduce time-to-market—all while ensuring superior quality and support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, which enhances the microcontroller's reliability and longevity.

Surface Mount: YES

Allows for compact designs and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

Versatile power supply options make it compatible with a range of systems.

Package Shape: SQUARE

Standard shape facilitates easy integration into various applications.

Bit Size: 32

Supports complex processing tasks and enhances performance for a variety of applications.

Power Supplies (V): 3.3/5

Flexible power requirements enable compatibility with many existing circuits.

No. of Terminals: 64

Provides ample I/O options for complex interfacing and connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained applications and easier soldering in automated processes.

Minimum Supply Voltage: 4.5 V

Allows for operation in a wider range of voltage environments.

Maximum Operating Temperature: 105 °C

Makes it suitable for industrial and high-temperature applications.

CPU Family: ARM7

Offers strong performance and is widely supported, ensuring compatibility with many software tools.

Minimum Operating Temperature: -40 °C

Robust performance in extreme cold, ideal for outdoor or harsh environment applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Enhanced corrosion resistance, providing better longevity and reliability in various environments.

ADC Channels: YES

Enables analog signal processing, making it suitable for sensor interfacing.

DMA Channels: YES

Improves data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Facilitates a high-density PCB layout and efficient signal routing.

ROM Words: 262144

Generous flash memory ensures sufficient storage for complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low profile design ideal for compact designs and high-density applications.

Width: 10 mm

Compact size allows for easy integration into smaller electronic devices.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Rich set of peripherals supports advanced functionality and various application needs.

Maximum Clock Frequency: 60 MHz

High clock speed improves performance, especially for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Robust reflow profile ensures compatibility with modern PCB assembly processes.

Peak Reflow Temperature (°C): 260

Compatible with high-temperature soldering processes, ensuring reliable assembly.

Length: 10 mm

Compact design contributes to smaller system sizes and reduced power consumption.

Temperature Grade: INDUSTRIAL

Designed for demanding industrial conditions, ensuring reliability in tough environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers efficient performance with low power consumption, suitable for various applications.

RAM Bytes: 16384

Sufficient RAM for handling multiple tasks and enhancing processing capabilities.

Technology: CMOS

Low power consumption combined with high-speed performance, leading to overall efficiency.

Terminal Form: GULL WING

Facilitates excellent soldering and mechanical stability on printed circuit boards.

Analog To Digital Converters: 11-Ch 10-Bit

Ability to process multiple analog signals, ideal for sensor and data acquisition applications.

Nominal Supply Voltage: 5 V

Standard voltage level allows easy integration into existing designs.

PWM Channels: YES

Ideal for motor control and brightness adjustment applications, offering better performance.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3)

Multiple communication protocols ensure versatile interfacing with a wide array of devices.

ROM Programmability: FLASH

Flash memory allows for easy software updates and changes.

Terminal Pitch: 0.5 mm

Finer pitch allows for a denser arrangement of components on small PCBs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures consistent performance in various environmental conditions.

Speed: 48 rpm

Suitable for low-speed applications, promoting energy efficiency.

On Chip Program ROM Width: 8

Enables efficient data handling and processing, contributing to overall performance.

No. of I/O Lines: 38

Provides flexibility in interfacing with various peripherals and devices.

Technical Specifications

Microcontrollers STR752FR2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR752FR2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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