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STR752FR2T6

STMicroelectronics

STR752FR2T6 by STMicroelectronics

STR752FR2T6 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, supports CAN/I2C/SPI/UART connectivity, and includes ADC/DMA capabilities for versatile applications. Ideal for industrial use, it offers robust performance with 16KB RAM and 262144 ROM.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,181 parts In-Stock

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4,181

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Anansix

USA . 2,595 parts In-Stock

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2,595

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Digiode

USA . 2,261 parts In-Stock

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2,261

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Distributors (Availability)

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Andel Nordic

Denmark . 3,855 parts In-Stock

1+ parts

$6.058

100+ parts

-

1k+ parts

$5.816

10k+ parts

$5.816

3,855

$6.058

-

$5.816

$5.816

Microchip USA

USA . 137 parts In-Stock

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$11.748

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-

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137

$11.748

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AZTECH Wire

Italy . 397 parts In-Stock

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$14.420

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397

$14.420

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$76.440

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$68.796

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433

$76.440

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$68.796

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Component Stockers USA

USA . 904 parts In-Stock

1+ parts

$85.120

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904

$85.120

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MKK Technologies

India . 76 parts In-Stock

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$143.741

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76

$143.741

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DigiPath Technology Company

USA . 76 parts In-Stock

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$143.741

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76

$143.741

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Parana Technologies

USA . 2,240 parts In-Stock

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$91.396

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2,240

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$91.396

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Corphita

USA . 1,529 parts In-Stock

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1,529

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Perfect Parts

USA . 538 parts In-Stock

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538

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Overview

Unlock unparalleled performance with the STR752FR2T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this 32-bit ARM7 powerhouse is perfect for demanding industrial applications, ensuring seamless connectivity and superior processing capabilities. Experience enhanced efficiency and longevity, backed by ST’s commitment to quality, making your projects not just viable but extraordinary. Elevate your designs with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material provides excellent protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, facilitating high-density circuit layouts.

Maximum Supply Voltage: 5.5 V

A relatively high maximum supply voltage range enhances the versatility of the microcontroller, accommodating a wide variety of power supply options.

Package Shape: SQUARE

The square shape optimizes thermal performance and space utilization on printed circuit boards, contributing to efficient design.

Bit Size: 32

With 32-bit architecture, the microcontroller supports advanced processing capabilities and can handle complex tasks more efficiently.

Power Supplies (V): 3.3/5

The dual supply voltage options increase flexibility for designers who need to integrate the microcontroller into existing systems with different voltage levels.

No. of Terminals: 64

Having 64 terminals allows for a greater number of I/O connections, making the microcontroller suitable for complex applications with numerous peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is ideal for applications where height is a constraint, allowing for more compact device designs.

Minimum Supply Voltage: 4.5 V

The operating range between 4.5 to 5.5 V is suitable for many standard applications, providing stability and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the microcontroller to perform reliably in harsh environments and industrial applications.

CPU Family: ARM7

ARM7 architecture provides a robust development platform with extensive support and optimized performance for embedded applications.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this microcontroller ideal for extreme conditions, ensuring reliability in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances the durability and corrosion resistance of connections, increasing longevity in operation.

ADC Channels: YES

Integrated ADC channels allow for real-time analog signal processing, crucial for sensors and other analog devices.

DMA Channels: YES

Direct Memory Access capabilities improve data transfer efficiency, freeing the CPU for other tasks and enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning contributes to better layout flexibility in PCB designs and improves signal integrity.

ROM Words: 262144

This extensive ROM storage enables the microcontroller to handle complex programs and applications efficiently.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for space-constrained applications, facilitating slim and compact product designs.

Width: 10 mm

At 10 mm width, this microcontroller is suitable for small form factor designs while still accommodating a wide range of functionalities.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

A diverse range of peripherals makes this microcontroller adaptable for numerous applications, enhancing its versatility.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz delivers good processing power for most applications, ensuring responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates robust thermal management and compatibility with standard reflow soldering processes, ensuring manufacturing reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures that the device can withstand high-temperature soldering processes without damage.

Length: 10 mm

The compact 10 mm length supports space-efficient designs, allowing for integration into smaller devices.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for durability and reliability in harsh environments, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution, contributing to lower power consumption and higher performance.

RAM Bytes: 16384

With 16384 bytes of RAM, the microcontroller can efficiently manage data and processes, making it suitable for complex applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are easy to solder, improving assembly efficiency and reliability in manufacturing processes.

Analog To Digital Convertors: 11-Ch 10-Bit

The microcontroller features multiple high-resolution ADC channels, enhancing its ability to process analog signals accurately.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5 V enables easy integration into existing systems and simplifies design requirements.

PWM Channels: YES

Pulse Width Modulation channels support efficient control of motors and other devices, making this microcontroller ideal for embedded systems.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3)

Wide-ranging connectivity options ensure that this microcontroller can communicate with various devices and components, enhancing interoperability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, facilitating design flexibility.

Terminal Pitch: 0.5 mm

The fine terminal pitch supports high-density layouts on PCBs, making the microcontroller suitable for compact applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate precautions are necessary, ensuring proper handling and packaging during manufacturing.

Speed: 48 rpm

This speed specification suggests potential applications in control systems requiring precision timing or tasked automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data handling and processing, facilitating various software applications.

No. of I/O Lines: 38

Having 38 I/O lines enables support for a wider range of external peripherals, enhancing functionality in various applications.

Technical Specifications

Microcontrollers STR752FR2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR752FR2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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