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STR750FV2T6

STMicroelectronics

STR750FV2T6 by STMicroelectronics

STR750FV2T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, supports various connectivity options like CAN and USB, making it ideal for industrial applications. With 16 ADC channels and up to 60 MHz clock speed, it excels in real-time processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,836 parts In-Stock

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Digiode

USA . 4,630 parts In-Stock

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Chip Stock

USA . 965 parts In-Stock

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965

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Anansix

USA . 477 parts In-Stock

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477

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ComSIT Distribution GmbH

Germany . 37 parts In-Stock

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37

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ComSIT USA

USA . 17 parts In-Stock

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Semi Source

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3

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Inventory MP

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 865 parts In-Stock

1+ parts

$11.590

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-

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865

$11.590

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

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$33.922

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-

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$30.530

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1,729

$33.922

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$30.530

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Advanced Electronics

New Zealand . 57 parts In-Stock

1+ parts

$61.556

100+ parts

$56.016

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$50.476

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57

$61.556

$56.016

$50.476

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MKK Technologies

India . 1,367 parts In-Stock

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$63.789

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$63.789

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DigiPath Technology Company

USA . 1,367 parts In-Stock

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$63.789

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Microchip USA

USA . 317 parts In-Stock

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$91.242

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317

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Component Stockers USA

USA . 546 parts In-Stock

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$99.990

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$99.990

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RC Electronics

USA . 9,762 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,216 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,218 parts In-Stock

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GlobX GmbH

Germany . 3,000 parts In-Stock

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Parana Technologies

USA . 2,228 parts In-Stock

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$40.559

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$40.559

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Corphita

USA . 1,493 parts In-Stock

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1,493

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Overview

Elevate your designs with the STR750FV2T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. Engineered for versatility, this powerful ARM7-based solution excels in industrial applications, offering superior performance with its robust 32-bit architecture. Enjoy seamless connectivity options and integrated peripherals that streamline development and enhance efficiency. Trust in STMicroelectronics’ legacy of quality to power your next project with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and reliability, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and facilitates automated assembly, enhancing production efficiency.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with various power supply systems and helps prevent damage from overvoltage.

Package Shape: SQUARE

Square package shape helps in better space management on PCBs, making it easier to integrate into compact designs.

Bit Size: 32

A 32-bit architecture enables efficient data processing and supports complex applications, enhancing performance.

Power Supplies (V): 3.3/5

Dual voltage supply options (3.3V and 5V) provide flexibility for various applications, accommodating different system requirements.

No. of Terminals: 100

A higher number of terminals allows for numerous I/O connections, supporting a wide variety of peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design minimizes space usage while maintaining a high terminal density, making it ideal for compact applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation over a range of conditions, enhancing reliability in various environments.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C enables the microcontroller to function effectively in high-temperature environments.

CPU Family: ARM7

The ARM7 CPU family offers a blend of power efficiency and performance, making it a strong choice for embedded applications.

Minimum Operating Temperature: -40 °C

Operation at a minimum temperature of -40 °C makes this microcontroller suitable for industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, simplifying the design and enhancing functionality.

DMA Channels: YES

The availability of DMA channels increases data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and improves soldering quality, ensuring reliability in connections.

ROM Words: 262144

A sizable ROM capacity provides ample space for firmware and program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

The low seated height is suitable for compact designs where space is a constraint, allowing for versatility in applications.

Width: 14 mm

A compact width ensures that the microcontroller fits easily into smaller devices and systems.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

The rich set of peripherals expands functionality, enabling diverse application use-case scenarios.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz provides high processing speeds necessary for demanding applications.

Length: 14 mm

This length contributes to a compact profile, making it easy to integrate into space-constrained environments.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and durability even under harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller provides enhanced performance and efficiency, making it suitable for real-time applications.

RAM Bytes: 16384

A reasonable RAM size supports complex calculations and data handling, enhancing the performance of applications.

Technology: CMOS

CMOS technology offers low power consumption and high scalability, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing terminals are easier to solder and handle, improving reliability and ease of manufacturing.

Analog To Digital Converters: 16-Ch 10-Bit

16-channel, 10-bit ADCs empower the microcontroller to handle multiple analog inputs, ideal for sensor applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard across many systems, ensuring compatibility with common power supplies.

PWM Channels: YES

Support for PWM channels allows for effective control of motors and other devices, increasing application versatility.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3), USB

A rich set of connectivity options ensures compatibility with various devices and protocols, enhancing application scope.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, ensuring long-term usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch optimizes space on the PCB while supporting high-density connections.

Speed: 48 rpm

Operating speed at 48 rpm suits applications requiring moderate-speed processing and control.

On Chip Program ROM Width: 8

The 8-bit ROM width enhances compatibility with various data processing applications, providing flexibility in design.

No. of I/O Lines: 72

Having 72 I/O lines offers ample connectivity options for peripheral devices, supporting complex applications.

Technical Specifications

Microcontrollers STR750FV2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3), USB

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR750FV2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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