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STR750FV2H6

STMicroelectronics

STR750FV2H6 by STMicroelectronics

STR750FV2H6 by STMicroelectronics is a 32-bit ARM7 microcontroller designed for industrial applications, featuring a max supply voltage of 5.5V and operating temp range from -40 °C to 85 °C. It includes 72 I/O lines, ADC, and PWM channels for versatile control. With a compact low-profile package, it’s ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,793 parts In-Stock

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8,793

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Anansix

USA . 2,038 parts In-Stock

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2,038

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Digiode

USA . 281 parts In-Stock

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281

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Distributors (Availability)

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Microchip USA

USA . 131 parts In-Stock

1+ parts

$11.307

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131

$11.307

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AZTECH Wire

Italy . 236 parts In-Stock

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$20.900

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236

$20.900

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IDEA Electronic Components Group

UK . 2,353 parts In-Stock

1+ parts

$46.601

100+ parts

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$41.941

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2,353

$46.601

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$41.941

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MKK Technologies

India . 296 parts In-Stock

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$87.630

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296

$87.630

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DigiPath Technology Company

USA . 296 parts In-Stock

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$87.630

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296

$87.630

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Corphita

USA . 2,607 parts In-Stock

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2,607

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Parana Technologies

USA . 1,894 parts In-Stock

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$55.718

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1,894

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$55.718

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Overview

Unlock unparalleled innovation with the STR750FV2H6 microcontroller from STMicroelectronics. Renowned for their exceptional quality and reliability, STMicroelectronics delivers a powerful solution that easily adapts to a variety of applications, from industrial automation to consumer electronics. With its robust performance, low power consumption, and advanced features, this microcontroller empowers engineers to create smarter, more efficient designs, ensuring your projects stand out in today’s competitive market. Elevate your development journey with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the microcontroller reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, catering well to modern electronic applications.

Maximum Supply Voltage: 5.5 V

This maximum voltage capability provides flexibility for different power supply configurations in devices.

Package Shape: SQUARE

The square package shape enhances stability and allows for efficient heat dissipation, which can improve performance.

Bit Size: 32

A 32-bit architecture enables handling of more complex computations and larger data sets, suitable for advanced applications.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V power supplies increases versatility in various design scenarios.

No. of Terminals: 100

With 100 terminals, this microcontroller can support a wide range of peripherals and interfaces, enhancing its capability.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style facilitates higher component density and a lower profile, benefiting space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V allows for operation in various power conditions, making it adaptable for different systems.

Maximum Operating Temperature: 85 °C

This temperature tolerance ensures reliable operation in industrial environments where conditions can vary significantly.

CPU Family: ARM7

ARM7 architecture is well-regarded for performance and efficiency, making it a popular choice for embedded systems.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures (-40 °C) makes this microcontroller suitable for harsh environments and outdoor applications.

Terminal Finish: TIN SILVER COPPER

A tin-silver-copper finish enhances solderability and longevity, ensuring reliable connections throughout the product's lifecycle.

ADC Channels: YES

The inclusion of ADC channels allows for precise analog signal processing, critical for applications needing sensor integration.

DMA Channels: YES

DMA support improves performance by enabling direct memory access and reducing CPU load during data transfers.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient soldering and compact PCB design.

ROM Words: 262144

The substantial ROM size supports complex applications, enabling more extensive firmware and functionality.

Maximum Seated Height: 1.7 mm

A low seated height allows for placement in space-constrained designs without compromising on performance.

Width: 10 mm

Compact width is ideal for tight design specifications and allows for effective thermal management.

Maximum Clock Frequency: 60 MHz

A 60 MHz clock frequency supports faster processing and better performance for demanding tasks.

Maximum Time At Peak Reflow Temperature: 30 s

The reflow specification ensures that the microcontroller can withstand the assembly process without damage.

Peak Reflow Temperature: 260 °C

Support for high reflow temperatures is beneficial for compatibility with various soldering processes.

Length: 10 mm

The rounded dimensions allow for flexible design choices without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure higher reliability and performance in rigorous operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture typically leads to higher performance with lower power consumption in embedded systems.

RAM Bytes: 16384

With 16KB of RAM, this microcontroller can handle a fair amount of data processing, suitable for moderate embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, perfect for battery-operated devices.

Terminal Form: BALL

Ball terminal form factor provides enhanced electrical performance and reliability in thermal cycling conditions.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V makes it easy to match with standard power supplies commonly used in the industry.

PWM Channels: YES

Presence of PWM channels allows for effective motor control and other applications requiring signal modulation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing the product's lifecycle.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for fine-pitch applications, leading to more densely packed PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity, providing guidance for handling to ensure quality during manufacturing.

Speed: 48 rpm

A speed specification of 48 rpm can be useful in certain automotive and industrial applications that require specific speed operations.

No. of I/O Lines: 72

With 72 I/O lines, this microcontroller supports a high number of input and output interfaces for comprehensive control and data manipulation.

Technical Specifications

Microcontrollers STR750FV2H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STR750FV2H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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