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STR750FV1T6

STMicroelectronics

STR750FV1T6 by STMicroelectronics

STR750FV1T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 100 terminals, 16 ADC channels, and supports various connectivity options like CAN and USB. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,549 parts In-Stock

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2,549

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Anansix

USA . 1,745 parts In-Stock

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1,745

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Digiode

USA . 1,122 parts In-Stock

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1,122

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Cyclops Electronics Ltd

UK . 680 parts In-Stock

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680

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Fibra_Brandt Electronic GMBH

Germany . 72 parts In-Stock

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,006 parts In-Stock

1+ parts

$9.740

100+ parts

-

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1,006

$9.740

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Microchip USA

USA . 371 parts In-Stock

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$25.597

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-

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371

$25.597

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IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$35.479

100+ parts

-

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$31.931

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558

$35.479

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$31.931

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MKK Technologies

India . 992 parts In-Stock

1+ parts

$66.716

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992

$66.716

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DigiPath Technology Company

USA . 992 parts In-Stock

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$66.716

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992

$66.716

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QUARKTWIN TECHNOLOGY LTD

USA . 25,673 parts In-Stock

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25,673

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RC Electronics

USA . 8,909 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,215 parts In-Stock

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$42.420

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$42.420

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Metaverse IC Inc.

Canada . 1,020 parts In-Stock

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Perfect Parts

USA . 893 parts In-Stock

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893

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Corphita

USA . 467 parts In-Stock

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467

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Elevate your designs with the STR750FV1T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. Engineered for versatility, this robust ARM7-based solution excels in industrial applications where performance meets efficiency. With features like advanced connectivity options and extensive peripheral support, it empowers you to create smart, responsive systems that stand the test of time. Trust in STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB real estate, enabling compact device designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring safety.

Package Shape: SQUARE

The square package shape facilitates efficient layout on circuit boards, which optimizes space utilization.

Bit Size: 32

The 32-bit architecture enhances processing capabilities, allowing for more complex computations and better performance.

Power Supplies (V): 3.3/5

Dual supply voltage options (3.3V and 5V) allow for greater versatility in application environments.

No. of Terminals: 100

A high number of terminals (100) allows for extensive connectivity and interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design is space-efficient and ideal for dense electronic layouts.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable performance in various power conditions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications.

CPU Family: ARM7

The ARM7 CPU family provides a strong performance-to-power ratio, making it ideal for energy-sensitive applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C ensures reliable functionality in extreme environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance.

ADC Channels: YES

Integrated ADC channels allow for accurate analog-to-digital conversions, essential for sensor data processing.

DMA Channels: YES

Presence of DMA channels enhances data handling efficiency by offloading CPU workloads, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning offers improved layout flexibility and ease of placement on PCBs.

ROM Words: 131072

A substantial ROM size allows for extensive firmware and application storage, accommodating complex software.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact device designs, crucial for portable electronic solutions.

Width: 14 mm

A standardized width facilitates compatibility with a variety of PCB layouts.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Diverse peripheral options make this microcontroller versatile, suitable for numerous applications.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz provides a good balance of performance for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard assembly processes, making it easier to integrate into production.

Peak Reflow Temperature °C: 250

Capability to withstand high reflow temperatures enhances reliability during soldering without damaging the chip.

Length: 14 mm

Consistent length allows for uniform installation and integration into existing device architectures.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specification indicates robustness for continuous operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to performance efficiency, making it suitable for efficient computing applications.

RAM Bytes: 16384

A generous RAM size of 16KB supports complex operations and multitasking capabilities within embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high reliability, which is ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and enhances mechanical stability.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel 10-bit ADCs enable versatile data acquisition from multiple analog sources simultaneously.

Nominal Supply Voltage: 5 V

A nominal supply of 5 V aligns with many common electronic components, making system integration simpler.

PWM Channels: YES

Integrated PWM channels allow for flexible control of motors and other peripherals, enhancing functionality.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3), USB

Wide connectivity options make it adaptable for various communication protocols, suitable for IoT applications.

ROM Programmability: FLASH

Flash programmability enables easy updates and changes to firmware, providing future-proof solutions.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density component configurations on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable moisture handling, suitable for standard processing environments.

Speed: 48 rpm

A specified speed of 48 rpm is adequate for controlling motors and sensors with precision.

On Chip Program ROM Width: 8

An 8-bit ROM width provides a balance between complexity and efficiency for data storage operations.

No. of I/O Lines: 72

A high number of I/O lines allows for connecting numerous peripherals and sensors, increasing application versatility.

Technical Specifications

Microcontrollers STR750FV1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3), USB

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR750FV1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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