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STR736FV2T7

STMicroelectronics

STR736FV2T7 by STMicroelectronics

STR736FV2T7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 72 I/O lines, 12 ADC channels, and supports various connectivity options like I2C and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Vyrian

USA . 3,575 parts In-Stock

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3,575

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Anansix

USA . 2,767 parts In-Stock

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2,767

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Chip Stock

USA . 133 parts In-Stock

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133

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Distributors (Availability)

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$9.390

100+ parts

-

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292

$9.390

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Microchip USA

USA . 362 parts In-Stock

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$16.503

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362

$16.503

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

1+ parts

$71.767

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-

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$64.591

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1,364

$71.767

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$64.591

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MKK Technologies

India . 2,085 parts In-Stock

1+ parts

$134.954

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2,085

$134.954

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DigiPath Technology Company

USA . 2,085 parts In-Stock

1+ parts

$134.954

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2,085

$134.954

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

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$85.809

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2,317

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$85.809

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Corphita

USA . 1,852 parts In-Stock

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1,852

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Perfect Parts

USA . 202 parts In-Stock

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202

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Overview

Unlock your project's potential with the STR736FV2T7 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for performance and versatility, this 32-bit ARM7 MCU excels in industrial applications, ensuring reliable operation even in extreme conditions. With advanced features like DMA channels and multiple connectivity options, it simplifies integration while optimizing efficiency. Elevate your innovations with a trusted brand that delivers unparalleled value and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and lightweight characteristics, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient space utilization on printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for a wide range of applications while ensuring safe operation.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and design, optimizing component placement.

Bit Size: 32

Being a 32-bit microcontroller provides significant processing power, allowing for complex computations.

Power Supplies (V): 5

Operating with a standard 5 V supply makes it compatible with common electronic systems and reduces power supply complexity.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine pitch design is ideal for high-density applications, enhancing product performance in tight spaces.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable operation in varied power conditions.

Maximum Operating Temperature: 105 C

The high maximum operating temperature makes it suitable for industrial applications that require durability in harsh environments.

CPU Family: ARM7

The ARM7 architecture provides advanced performance and energy efficiency, making it an ideal choice for embedded systems.

Minimum Operating Temperature: -40 C

This temperature range allows for operation in extreme environments, essential for outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures excellent conductivity and resistance to corrosion, promoting reliable performance.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with sensors, enhancing the microcontroller's versatility.

DMA Channels: YES

DMA channels improve data transfer efficiency, freeing up CPU resources for other tasks and improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides flexible mounting options on PCBs, facilitating easier design integration.

ROM Words: 262144

With 262144 ROM words, the microcontroller offers sufficient memory capacity for complex applications and firmware.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous in space-constrained environments, contributing to slimmer designs.

Width: 14 mm

A compact width of 14 mm enhances integration in small devices without sacrificing performance.

Peripherals: DMA(4), POR, RTC, TIMER(6), WDT

A rich set of peripherals allows for extensive functionality, enabling advanced control and monitoring capabilities.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency balances performance and power efficiency, tailoring the microcontroller for diverse applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature facilitates compatibility with modern soldering techniques, ensuring manufacturing flexibility.

Length: 14 mm

At 14 mm in length, this microcontroller is well-suited for compact projects and devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions ensures reliability and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture leads to efficient instruction processing, making it well-suited for performance-intensive tasks.

RAM Bytes: 16384

With 16384 bytes of RAM, sufficient memory for your applications is provided, enabling efficient task execution.

Technology: CMOS

CMOS technology contributes to low power consumption, making it energy-efficient for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminations provide a reliable solder joint while facilitating easy PCB assembly.

Analog To Digital Converters: 12-Ch 10-Bit

The 12-channel, 10-bit ADCs support versatile analog input, enabling integration with various sensor types.

Nominal Supply Voltage: 5 V

Operating at a typical 5 V supply enhances compatibility with other components in a system.

PWM Channels: YES

Programmable PWM channels allow for precise control of motors and lights, improving application capabilities.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options (I2C, SPI, UART) enable integration with a range of devices and sensors.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and flexibility in firmware development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density layouts while maintaining reliability in connections.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates moderate handling precautions, suitable for most manufacturing environments.

Speed: 36 rpm

A speed rating of 36 rpm indicates the microcontroller's capability to handle dynamic applications effectively.

On Chip Program ROM Width: 8

The 8-bit ROM width enhances data handling capacity, supporting efficient program execution.

No. of I/O Lines: 72

With 72 I/O lines, the microcontroller supports a large number of peripherals and components, expanding application possibilities.

Technical Specifications

Microcontrollers STR736FV2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR736FV2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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