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STR736FV1T6

STMicroelectronics

STR736FV1T6 by STMicroelectronics

STR736FV1T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, 12 ADC channels, and supports various connectivity options like I2C and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 5,940 parts In-Stock

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5,940

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Vyrian

USA . 3,200 parts In-Stock

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3,200

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Anansix

USA . 781 parts In-Stock

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781

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Digiode

USA . 151 parts In-Stock

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151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 823 parts In-Stock

1+ parts

$9.790

100+ parts

-

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823

$9.790

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Microchip USA

USA . 257 parts In-Stock

1+ parts

$33.801

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-

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257

$33.801

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$39.438

100+ parts

-

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$35.494

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1,193

$39.438

-

$35.494

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MKK Technologies

India . 1,749 parts In-Stock

1+ parts

$74.160

100+ parts

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1,749

$74.160

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DigiPath Technology Company

USA . 1,749 parts In-Stock

1+ parts

$74.160

100+ parts

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1,749

$74.160

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QUARKTWIN TECHNOLOGY LTD

USA . 13,273 parts In-Stock

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13,273

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Kepictronics

USA . 5,940 parts In-Stock

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5,940

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Metaverse IC Inc.

Canada . 5,940 parts In-Stock

1+ parts

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5,940

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Corphita

USA . 4,744 parts In-Stock

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4,744

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A-Z Elektronik GmbH

Germany . 1,782 parts In-Stock

1+ parts

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1,782

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Parana Technologies

USA . 427 parts In-Stock

1+ parts

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100+ parts

$47.154

1k+ parts

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427

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$47.154

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Overview

Unlock the potential of your next project with the STR736FV1T6 microcontroller from STMicroelectronics. Known for their commitment to quality and innovation, STMicroelectronics ensures reliability and performance in every chip. The STR736FV1T6 provides outstanding versatility for a wide range of applications—from industrial automation to consumer electronics—delivering efficient processing power and connectivity options that simplify design and enhance functionality. Elevate your product development today with this exceptional solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials enhances durability and reliability, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage provides flexibility for integration with standard power levels in many applications.

Package Shape: SQUARE

A square package shape allows for efficient layout and routing on PCBs.

Bit Size: 32

The 32-bit architecture supports more complex computations and improves performance for advanced applications.

Power Supplies (V): 5

Operating at 5V makes this microcontroller compatible with common digital logic levels.

No. of Terminals: 100

With 100 terminals, this microcontroller can support extensive peripheral connections and complex designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style supports high-density PCB designs, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage allows operation in a wider range of environments, making it versatile.

Maximum Operating Temperature: 85 °C

Operating at high temperatures makes this microcontroller suitable for industrial applications.

CPU Family: ARM7

ARM7 architecture provides efficient processing and a strong ecosystem with extensive software support.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold makes the microcontroller ideal for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

ADC Channels: YES

With ADC channels, the microcontroller can process analog signals, making it ideal for sensor applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and improves thermal dissipation.

ROM Words: 131072

A large ROM capacity allows for more complex programs and functionalities in applications.

Maximum Seated Height: 1.6 mm

Low profile height aids in compact designs and enhances the overall aesthetics of the device.

Width: 14 mm

A compact width facilitates integration into smaller devices and systems.

Peripherals: DMA(4), POR, RTC, TIMER(16), WDT

Diverse peripheral support enhances functionality and versatility in various application scenarios.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency allows for efficient processing while balancing power consumption.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern soldering processes.

Length: 14 mm

A standard length is conducive for easy integration with other electronic components.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures reliability in challenging environments typical for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller improves instruction efficiency and performance.

RAM Bytes: 16384

Sufficient RAM for data handling allows for complex functionalities and multitasking.

Technology: CMOS

CMOS technology makes this microcontroller energy-efficient, supporting low-power applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve the performance of PCB connections.

Analog To Digital Converters: 12-Ch 10-Bit

The capability to convert analog signals with multiple channels provides versatility in sensor applications.

Nominal Supply Voltage: 5 V

The nominal voltage aligns with common industry standards, ensuring compatibility with existing systems.

PWM Channels: YES

PWM channels allow for motor control and dimming applications, enhancing functional versatility.

Connectivity: I2C(2), SPI(3), UART(4)

Rich connectivity options enable seamless interfacing with various devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes to the firmware without reprogramming the hardware.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables high-density designs, essential for modern electronic applications.

Moisture Sensitivity Level (MSL): 3

A moderate moisture sensitivity level ensures reliability during manufacturing and handling processes.

Speed: 36 rpm

This speed rating suggests capability in real-time control applications, enhancing overall performance.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width supports efficient coding and execution of operations.

No. of I/O Lines: 72

A greater number of I/O lines allows for extensive interfacing with multiple sensors and peripherals.

Technical Specifications

Microcontrollers STR736FV1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR736FV1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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