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STR736FV0T6

STMicroelectronics

STR736FV0T6 by STMicroelectronics

STR736FV0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, 12 ADC channels, and supports various connectivity options like I2C and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,329 parts In-Stock

1+ parts

-

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8,329

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Digiode

USA . 4,905 parts In-Stock

1+ parts

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4,905

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Anansix

USA . 2,780 parts In-Stock

1+ parts

-

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-

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2,780

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 891 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$3.000

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-

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Microchip USA

USA . 117 parts In-Stock

1+ parts

$13.417

100+ parts

-

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-

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117

$13.417

-

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AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$21.910

100+ parts

-

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805

$21.910

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-

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

1+ parts

$31.728

100+ parts

-

1k+ parts

$28.555

10k+ parts

-

1,088

$31.728

-

$28.555

-

MKK Technologies

India . 1,104 parts In-Stock

1+ parts

$59.663

100+ parts

-

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10k+ parts

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1,104

$59.663

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DigiPath Technology Company

USA . 1,104 parts In-Stock

1+ parts

$59.663

100+ parts

-

1k+ parts

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10k+ parts

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1,104

$59.663

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QUARKTWIN TECHNOLOGY LTD

USA . 25,843 parts In-Stock

1+ parts

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25,843

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Corphita

USA . 2,740 parts In-Stock

1+ parts

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2,740

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Perfect Parts

USA . 1,714 parts In-Stock

1+ parts

-

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1,714

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RC Electronics

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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-

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Parana Technologies

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$37.936

1k+ parts

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10k+ parts

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735

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$37.936

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Overview

Unlock the future of innovation with the STR736FV0T6 microcontroller from STMicroelectronics, a leader in high-performance solutions. Designed for reliability and efficiency, this 32-bit ARM7 powerhouse excels in demanding applications across industrial automation, consumer electronics, and IoT devices. Enjoy seamless connectivity options and robust performance, ensuring your projects thrive while benefitting from ST's exceptional quality and support. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to various environmental conditions, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for smaller and lighter designs, enhancing space efficiency in electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum voltage of 5.5 V is safe for a variety of circuits, ensuring compatibility with many power supply systems.

Package Shape: SQUARE

The square package shape facilitates better layout options on PCB, improving design flexibility.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency for handling complex operations.

Power Supplies (V): 5

Operating at a nominal 5V makes it easy to integrate with other standard components in consumer electronics.

No. of Terminals: 100

A higher number of terminals allows for more I/O connections, enabling complex applications and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design is optimal for space-constrained applications, making it ideal for compact electronics.

Minimum Supply Voltage: 4.5 V

This range of supply voltage allows for flexibility in power supply design and efficiency.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for industrial applications that operate in harsher environments.

CPU Family: ARM7

The ARM7 family is known for its strong performance and low power consumption, making it ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

A -40 °C minimum operating temperature makes this microcontroller suitable for use in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers excellent corrosion resistance and enhances electrical conductivity, ensuring reliable performance.

ADC Channels: YES

The presence of ADC channels allows for easy interaction with analog sensors, broadening the range of applications.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving performance in data-heavy applications.

Terminal Position: QUAD

Quad terminal positioning ensures a stable connection and easier soldering during assembly.

ROM Words: 65536

With 65536 words of ROM, there is ample space for firmware storage, facilitating complex applications.

Maximum Seated Height: 1.6 mm

A low seated height aids in maintaining a flat profile in designs, minimizing overall device thickness.

Width: 14 mm

Compact width makes it suitable for applications where space is critical.

Peripherals: DMA(4), POR, RTC, TIMER(16), WDT

The range of peripherals enhances functionality, providing capabilities such as real-time clock management and timer control.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency is sufficient for many control applications while keeping power consumption in check.

Peak Reflow Temperature °C: 260

The peak reflow temperature capability makes it compatible with common surface mount assembly processes.

Length: 14 mm

A length of 14 mm ensures a compact design, suitable for projects with limited space.

Temperature Grade: INDUSTRIAL

An industrial temperature grading indicates reliability in demanding environments, appealing to industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture streamlines instructions, enhancing processing efficiency and performance.

RAM Bytes: 16384

With 16384 bytes of RAM, it supports adequate data handling for typical applications, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide robust connections, improving reliability.

Analog To Digital Convertors: 12-Ch 10-Bit

Having 12 channels of 10-bit ADC means the microcontroller can effectively interface with numerous sensors concurrently.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is universally compatible, simplifying design and integration efforts.

PWM Channels: YES

PWM channels allow for advanced control processes such as motor control and signal modulation.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options enhance the ability to interface with various devices and expand functionality.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, adding flexibility to product development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for closer terminal layout, crucial for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL Level 3 indicates a moderate sensitivity to moisture, guiding proper storage and handling practices.

Speed: 36 rpm

While not very high, this speed indicates suitability for specific applications, especially low-speed motor controls.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a range of application requirements without unnecessary complexity.

No. of I/O Lines: 72

A high number of I/O lines allows for extensive peripheral interaction and complex input/output configurations.

Technical Specifications

Microcontrollers STR736FV0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR736FV0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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