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STR735FZ2H7

STMicroelectronics

STR735FZ2H7 by STMicroelectronics

STR735FZ2H7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 144 terminals, supports I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and flash ROM programmability, it's perfect for complex control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,427 parts In-Stock

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8,427

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Digiode

USA . 2,955 parts In-Stock

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2,955

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Anansix

USA . 1,928 parts In-Stock

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1,928

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Distributors (Availability)

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AZTECH Wire

Italy . 942 parts In-Stock

1+ parts

$17.550

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-

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942

$17.550

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Microchip USA

USA . 210 parts In-Stock

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$18.499

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210

$18.499

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IDEA Electronic Components Group

UK . 200 parts In-Stock

1+ parts

$75.573

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$68.016

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200

$75.573

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$68.016

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MKK Technologies

India . 857 parts In-Stock

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$142.111

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857

$142.111

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DigiPath Technology Company

USA . 857 parts In-Stock

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$142.111

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857

$142.111

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Corphita

USA . 1,947 parts In-Stock

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1,947

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Parana Technologies

USA . 1,732 parts In-Stock

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$90.360

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1,732

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$90.360

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Overview

Elevate your projects with the STR735FZ2H7 microcontroller from STMicroelectronics, a trusted leader in innovation. This robust 32-bit ARM7 solution delivers exceptional reliability and versatility for industrial applications. With its low power consumption and extensive I/O options, it ensures seamless integration into any design. Experience peace of mind knowing you're backed by ST's commitment to quality, performance, and cutting-edge technology, all while enhancing your product’s efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides excellent protection and thermal stability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage enhances compatibility with various electronic components.

Package Shape: SQUARE

Square package shape optimizes space usage on PCBs, accommodating complex designs.

Bit Size: 32

A 32-bit architecture allows for more powerful processing and enhanced performance for complex tasks.

Power Supplies: 5 V

5V power supply ensures compatibility with most standard electronic systems.

No. of Terminals: 144

144 terminals provide extensive connectivity options for versatile application needs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile fine pitch grid array style enables high-density layouts, crucial for space-constrained designs.

Minimum Supply Voltage: 4.5 V

The broad supply voltage range ensures reliable operation under varying power conditions.

Maximum Operating Temperature: 105 C

High-temperature tolerance makes this microcontroller suitable for industrial applications and harsh environments.

CPU Family: ARM7

The ARM7 CPU family offers efficient architecture, optimizing performance and energy consumption.

Minimum Operating Temperature: -40 C

Wide temperature range (-40 °C to 105 °C) ensures reliable performance in diverse environmental conditions.

Terminal Finish: TIN SILVER COPPER

Tin-silver-copper finishing enhances solderability and improves corrosion resistance.

ADC Channels: YES

Integrated analog-to-digital conversion capabilities facilitate sensor integration and data acquisition.

DMA Channels: YES

Direct Memory Access support allows for efficient data handling without CPU intervention, enhancing performance.

Terminal Position: BOTTOM

Bottom terminal positioning is ideal for effective heat dissipation and reliable performance.

ROM Words: 262144

Substantial ROM allows for sophisticated firmware and application programming, enhancing functionality.

Maximum Seated Height: 1.7 mm

Low seated height contributes to a compact overall design, essential for modern electronics.

Width: 10 mm

Standard width suits various PCB designs while maintaining a compact footprint.

Peripherals: DMA(4), POR, RTC, TIMER(10), WDT

A rich set of peripheral features supports a wide range of applications, from timing to power management.

Maximum Clock Frequency: 8 MHz

8 MHz clock frequency enables sufficient processing speed for many control and automation tasks.

Maximum Time At Peak Reflow Temperature: 30 s

Designed to withstand peak reflow temperatures, ensuring reliable assembly processes during manufacturing.

Peak Reflow Temperature: 260 C

High peak reflow temperature rating allows compatibility with modern soldering techniques and materials.

Length: 10 mm

Compact length enhances versatility for various board designs without compromising on functionality.

Temperature Grade: INDUSTRIAL

Industrial grade ensures higher reliability and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture is optimized for high performance and efficiency, making it an excellent choice for embedded systems.

RAM Bytes: 16384

Ample RAM allows for more complex and memory-intensive applications, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form factor provides good mechanical stability and reliable connections in portable devices.

Analog To Digital Converters: 16-Ch 10-Bit

16-channel 10-bit ADCs facilitate comprehensive data collection, supporting multi-sensor setups.

Nominal Supply Voltage: 5 V

Nominal 5V supply voltage guarantees compatibility with a wide range of components and peripheral devices.

PWM Channels: YES

PWM channels enable precise control of motors and other applications requiring variable speed/brightness.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options facilitate easy integration with various peripherals and communication protocols.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and flexibility in software management.

Terminal Pitch: 0.8 mm

Tighter terminal pitch allows for higher density designs, maximizing the use of available PCB space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates appropriate handling and storage requirements, ensuring product usability post-manufacturing.

Speed: 36 rpm

This speed specification is suitable for applications requiring moderate rotational speeds in motors.

On Chip Program ROM Width: 8

An 8-bit wide ROM allows for efficient code storage while maintaining simplicity and efficiency in design.

No. of I/O Lines: 112

With 112 I/O lines, this microcontroller can interface with a wide array of peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers STR735FZ2H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(10), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR735FZ2H7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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