Loading...

STR735FZ2H6

STMicroelectronics

STR735FZ2H6 by STMicroelectronics

STR735FZ2H6 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 144 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,384

-

-

-

-

Digiode

USA . 1,357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,357

-

-

-

-

Anansix

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 278 parts In-Stock

1+ parts

$14.790

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$14.790

-

-

-

AZTECH Wire

Italy . 1,195 parts In-Stock

1+ parts

$16.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,195

$16.190

-

-

-

IDEA Electronic Components Group

UK . 566 parts In-Stock

1+ parts

$30.119

100+ parts

-

1k+ parts

$27.107

10k+ parts

-

566

$30.119

-

$27.107

-

MKK Technologies

India . 1,064 parts In-Stock

1+ parts

$56.637

100+ parts

-

1k+ parts

-

10k+ parts

-

1,064

$56.637

-

-

-

DigiPath Technology Company

USA . 1,064 parts In-Stock

1+ parts

$56.637

100+ parts

-

1k+ parts

-

10k+ parts

-

1,064

$56.637

-

-

-

Corphita

USA . 4,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,988

-

-

-

-

Parana Technologies

USA . 293 parts In-Stock

1+ parts

-

100+ parts

$36.012

1k+ parts

-

10k+ parts

-

293

-

$36.012

-

-

Overview

Unlock the potential of your projects with the STR735FZ2H6 microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, STMicroelectronics delivers cutting-edge solutions ideal for industrial automation, consumer electronics, and beyond. With a robust ARM7 architecture and versatile features, this microcontroller ensures seamless performance under varying conditions, empowering you to innovate without limits. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures good protection and reliability for the microcontroller in various environments.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, making it suitable for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options for different applications.

Package Shape: SQUARE

The square package shape allows for easier fitting in space-constrained designs.

Bit Size: 32

A 32-bit architecture enhances computing power, enabling the handling of complex tasks and algorithms.

Power Supplies (V): 5

Operating at 5 V is standard for many applications, ensuring compatibility with commonly used power supplies.

No. of Terminals: 144

With 144 terminals, this microcontroller offers extensive connectivity options for integrating peripheral devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile and fine pitch layout maximizes board space while facilitating efficient connections.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for operation in a wider range of power supply conditions.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes it suitable for industrial applications where heat can be a concern.

CPU Family: ARM7

Being part of the ARM7 family means access to a powerful and widely supported architecture.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is ideal for harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

The Tin-Silver-Copper finish enhances solderability and reliability in connections.

ADC Channels: YES

The presence of ADC channels allows for analog input processing, making it versatile for various applications.

DMA Channels: YES

Having DMA channels improves data transfer efficiency, reducing CPU load and enhancing overall performance.

Terminal Position: BOTTOM

Bottom-terminal configuration simplifies mounting and can enhance thermal performance.

ROM Words: 262144

A large ROM capacity of 262144 words provides ample space for program storage and complex applications.

Maximum Seated Height: 1.7 mm

A maximum seated height of 1.7 mm ensures a low profile, fitting well in compact systems.

Width: 10 mm

The 10 mm width strikes a balance between compactness and compatibility with standard circuit layouts.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency allows for adequate processing speed for a variety of control tasks.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow duration of 30 seconds ensures compatibility with common soldering processes.

Peak Reflow Temperature: 260 °C

With a peak reflow temperature of 260 °C, this microcontroller can withstand the rigors of reflow soldering.

Length: 10 mm

At 10 mm in length, it maintains a compact design suitable for space-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding applications and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC type microcontroller, it delivers efficient processing capabilities tailored for embedded applications.

RAM Bytes: 16384

With 16384 bytes of RAM, it can handle moderate data processing needs effectively.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, promoting energy-efficient operation.

Terminal Form: BALL

Ball terminal form enhances electrical connectivity and is suitable for high-density interconnect applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with industry standards, making integration straightforward.

PWM Channels: YES

Support for PWM channels enables precise control of motors and actuators, vital for automation projects.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, enhancing long-term usability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm facilitates high-density layouts while still supporting manageable soldering.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 suggests moderate moisture sensitivity, warranting proper handling and storage.

Speed: 36 rpm

The specified speed of 36 rpm suggests it's suitable for specific timing or motor control applications.

No. of I/O Lines: 112

With 112 I/O lines, this microcontroller offers extensive interfacing capabilities, supporting a variety of peripherals.

Technical Specifications

Microcontrollers STR735FZ2H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STR735FZ2H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20