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STR735FZ1H7

STMicroelectronics

STR735FZ1H7 by STMicroelectronics

STR735FZ1H7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 144 terminals, supports I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and DMA capabilities, it ensures efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,304 parts In-Stock

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10,304

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Digiode

USA . 2,064 parts In-Stock

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2,064

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Anansix

USA . 1,041 parts In-Stock

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,055 parts In-Stock

1+ parts

$12.490

100+ parts

-

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1,055

$12.490

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IDEA Electronic Components Group

UK . 1,836 parts In-Stock

1+ parts

$45.736

100+ parts

-

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$41.162

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1,836

$45.736

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$41.162

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MKK Technologies

India . 290 parts In-Stock

1+ parts

$86.003

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290

$86.003

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DigiPath Technology Company

USA . 290 parts In-Stock

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$86.003

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290

$86.003

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QUARKTWIN TECHNOLOGY LTD

USA . 29,376 parts In-Stock

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29,376

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Microchip USA

USA . 4,160 parts In-Stock

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Corphita

USA . 1,602 parts In-Stock

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1,602

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Parana Technologies

USA . 354 parts In-Stock

1+ parts

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$54.684

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354

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$54.684

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Overview

Unlock the power of innovation with the STR735FZ1H7 microcontroller from STMicroelectronics! Renowned for their commitment to excellence, STMicroelectronics brings you this robust, 32-bit ARM7 solution designed for a wide range of applications—from industrial automation to smart home devices. With superior performance, low power consumption, and advanced connectivity options, the STR735FZ1H7 ensures seamless integration and reliability, empowering your projects to reach new heights of efficiency and sophistication. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and can contribute to higher performance as well as more efficient space usage on PCBs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is ideal for applications that operate within standard voltage ranges.

Package Shape: SQUARE

The square package shape facilitates easy placement on PCBs and allows for efficient thermal management.

Bit Size: 32

Being a 32-bit microcontroller allows for enhanced processing capabilities and better performance in complex calculations and tasks.

Power Supplies (V): 5

The requirement for a 5 V power supply simplifies integration with a wide range of devices and power sources.

No. of Terminals: 144

With 144 terminals, this microcontroller can support numerous peripherals and I/O connections for versatile applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile, fine pitch grid array style contributes to space-saving designs while maintaining robust connections.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V enables operation in various applications with slightly lower power supply options.

Maximum Operating Temperature: 105 °C

Operating at temperatures up to 105 °C makes this microcontroller suitable for industrial environments where heat dissipation is a concern.

CPU Family: ARM7

The ARM7 CPU family provides efficient processing capabilities and a robust architecture, well-regarded in embedded systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device can be utilized in extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish enhances solderability and corrosion resistance, promoting reliable connections.

ADC Channels: YES

Having ADC channels allows for direct interfacing with analog signals, making it suitable for sensor applications.

DMA Channels: YES

DMA support enables efficient data transfers without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient power delivery and signal integrity in compact layouts.

ROM Words: 131072

An adequate ROM capacity of 131072 words allows for substantial program storage, accommodating complex applications.

Maximum Seated Height: 1.7 mm

The low seated height minimizes the profile of the assembled device, which is advantageous for space-constrained designs.

Width: 10 mm

A compact width of 10 mm is ideal for applications requiring small footprint solutions.

Peripherals: DMA(4), POR, RTC, TIMER(10), WDT

Integrated peripherals provide advanced functionalities, enhancing the microcontroller's operational capabilities.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency ensures a balance between performance and power consumption for various embedded applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures the microcontroller can handle the reflow soldering process without damage.

Peak Reflow Temperature: 260 °C

Peak reflow temperature resilience ensures compatibility with modern PCB manufacturing processes.

Length: 10 mm

The 10 mm length provides a compact solution ideal for small-scale embedded systems.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for long-term reliability in challenging environments, extending product lifecycle.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance through efficient instruction execution, making it optimal for embedded tasks.

RAM Bytes: 16384

With 16 KB of RAM, this microcontroller supports moderate data manipulation and application execution efficiently.

Technology: CMOS

CMOS technology ensures low power consumption, which is critical for battery-operated and portable applications.

Terminal Form: BALL

Ball terminal form contributes to better electrical performance and efficient heat dissipation.

Analog To Digital Converters: 16-Ch 10-Bit

The availability of 16 channels of 10-bit analog-to-digital conversion supports a wide range of sensing applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V simplifies design requirements and aligns with standard power supply systems.

PWM Channels: YES

Support for PWM channels enables precise control of motors and other devices, useful in automation and robotics.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple communication protocols such as I2C, SPI, and UART provide versatility for interfacing with other devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and firmware changes, enhancing product longevity and adaptability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is suitable for high-density designs while maintaining reliable connections.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, supporting proper handling and storage conditions.

Speed: 36 rpm

While not typical for microcontrollers, this speed specification may refer to application performance, indicating versatility.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, the microcontroller can efficiently handle data operations, suitable for various applications.

No. of I/O Lines: 112

Offering 112 I/O lines enables extensive device connections and functionalities, making it ideal for complex embedded projects.

Technical Specifications

Microcontrollers STR735FZ1H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(10), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR735FZ1H7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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