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STR731FV2T7

STMicroelectronics

STR731FV2T7 by STMicroelectronics

STR731FV2T7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. It features 100 terminals, supports multiple connectivity options, and includes ADC/DMA channels for versatile applications. Ideal for industrial automation, it offers robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,825 parts In-Stock

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4,825

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Anansix

USA . 2,018 parts In-Stock

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2,018

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Chip Stock

USA . 665 parts In-Stock

1+ parts

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665

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Digiode

USA . 538 parts In-Stock

1+ parts

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538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$21.370

100+ parts

-

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-

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-

438

$21.370

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IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$43.212

100+ parts

-

1k+ parts

$38.891

10k+ parts

-

237

$43.212

-

$38.891

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MKK Technologies

India . 710 parts In-Stock

1+ parts

$81.258

100+ parts

-

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710

$81.258

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$81.258

100+ parts

-

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710

$81.258

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Component Stockers USA

USA . 217 parts In-Stock

1+ parts

$99.990

100+ parts

-

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217

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,615 parts In-Stock

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29,615

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 3,169 parts In-Stock

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3,169

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Corphita

USA . 2,681 parts In-Stock

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2,681

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Perfect Parts

USA . 1,220 parts In-Stock

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1,220

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Parana Technologies

USA . 1,215 parts In-Stock

1+ parts

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100+ parts

$51.667

1k+ parts

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1,215

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$51.667

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Overview

Unlock unparalleled performance with the STR731FV2T7 microcontroller from STMicroelectronics, renowned for its commitment to quality and innovation. Designed for versatility across various applications—from industrial automation to consumer electronics—this powerful ARM7 solution excels in reliability and efficiency. With advanced connectivity options and robust features, it empowers your projects while reducing time-to-market, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, ensuring reliability in various operating conditions.

Surface Mount: YES

The surface mount capability enhances the ease of integration into compact designs, making it suitable for modern electronic applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is compatible with a range of power sources, simplifying design considerations.

Package Shape: SQUARE

The square shape of the package allows for flexible PCB layout options, facilitating efficient space utilization.

Bit Size: 32

A 32-bit architecture provides improved processing power and efficiency, making it suitable for complex applications.

Power Supplies (V): 5

Operating on a standard 5V supply voltage encourages compatibility with common power sources and devices.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options for diverse peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design promotes reduced height and improved thermal characteristics, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation under variable power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller is suitable for use in harsh and industrial environments.

CPU Family: ARM7

The ARM7 CPU family is known for its efficiency and performance, enabling robust applications with excellent support.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller ideal for extreme temperature applications, like automotive and industrial equipment.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides excellent corrosion resistance and long-term reliability in connections.

ADC Channels: YES

Integrated ADC channels facilitate direct interfacing with analog sensors, allowing for versatile application development.

DMA Channels: YES

With DMA channels, the microcontroller offers enhanced data handling capabilities, reducing CPU load and improving system performance.

Terminal Position: QUAD

The quad terminal position allows for easier soldering and efficient PCB layout, improving design flexibility.

ROM Words: 262144

A large ROM capacity of 262144 words allows for substantial program storage, accommodating complex application requirements.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm supports intricate designs while maintaining a low profile.

Width: 14 mm

The compact width of 14 mm aids in efficient circuit board layout without limiting functionality.

Peripherals: DMA(4), POR, RTC, TIMER(6), WDT

An extensive range of peripherals enhances the microcontroller's capabilities, making it versatile for various applications.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency delivers adequate processing power for real-time applications while being efficient.

Peak Reflow Temperature °C: 260

The peak reflow temperature rating of 260 °C supports compatibility with modern assembly processes.

Length: 14 mm

The uniform length of 14 mm enhances symmetry in designs and allows for compact PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, the microcontroller guarantees performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it boasts efficient processing capabilities, making it suitable for a wide range of embedded applications.

RAM Bytes: 16384

With 16384 bytes of RAM, ample temporary storage is provided for data handling, enhancing performance in computations.

Technology: CMOS

CMOS technology ensures low power consumption, extending battery life in portable applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies surface mounting and provides robust connections in circuit designs.

Analog To Digital Converts: 12-Ch 10-Bit

The presence of 12 channels of 10-bit ADC offers versatility for interfacing multiple analog signals efficiently.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V makes this microcontroller compatible with a wide range of devices and systems.

PWM Channels: YES

PWM channels allow for precise control in applications such as motor control and signal modulation.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Multiple connectivity options provide extensive interoperability with other devices and systems, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications, allowing for flexible application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density PCB layouts, making efficient use of space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, providing ample time for proper handling during assembly.

Speed: 36 rpm

A speed of 36 rpm is suitable for efficient operation of devices requiring moderate speed control.

On Chip Program ROM Width: 8

An 8-bit ROM width provides compatibility with a wide range of programming models and ease of use.

No. of I/O Lines: 72

Having 72 I/O lines enhances input-output capabilities, allowing for numerous attachments and functionality.

Technical Specifications

Microcontrollers STR731FV2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR731FV2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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