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STR715FR0H6

STMicroelectronics

STR715FR0H6 by STMicroelectronics

STR715FR0H6 by STMicroelectronics is a 32-bit ARM7 microcontroller designed for industrial applications, operating b/w -40 °C and 85 °C. It features a max supply voltage of 3.6V, 64 terminals, and supports ADC/PWM channels. Ideal for low-profile designs with fine pitch requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,505 parts In-Stock

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5,505

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Digiode

USA . 3,097 parts In-Stock

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3,097

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Anansix

USA . 1,590 parts In-Stock

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1,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 221 parts In-Stock

1+ parts

$7.906

100+ parts

-

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221

$7.906

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AZTECH Wire

Italy . 963 parts In-Stock

1+ parts

$10.230

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963

$10.230

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IDEA Electronic Components Group

UK . 2,359 parts In-Stock

1+ parts

$45.117

100+ parts

-

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$40.605

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2,359

$45.117

-

$40.605

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MKK Technologies

India . 695 parts In-Stock

1+ parts

$84.839

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695

$84.839

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DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$84.839

100+ parts

-

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695

$84.839

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Kepictronics

USA . 6,365 parts In-Stock

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6,365

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RC Electronics

USA . 6,005 parts In-Stock

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6,005

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Parana Technologies

USA . 650 parts In-Stock

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$53.944

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650

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$53.944

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Corphita

USA . 61 parts In-Stock

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Overview

Experience unparalleled performance with the STR715FR0H6 microcontroller from STMicroelectronics. Designed for demanding applications, this 32-bit ARM7 solution combines reliability and efficiency, ensuring your projects thrive in industrial environments. With robust features like ADC and PWM channels, it empowers innovation across diverse sectors. Trust in STMicroelectronics' legacy of quality to elevate your designs, transforming ideas into reality with precision and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material choice contributes to overall robustness and suitability for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly.

Maximum Supply Voltage: 3.6 V

Safe operating voltage range ensures compatibility with low-power systems while protecting against overvoltage.

Package Shape: SQUARE

Square package shape supports better space utilization on PCB layouts.

Bit Size: 32

32-bit architecture enables efficient processing power for complex applications.

Power Supplies (V): 3.3

Standardized voltage level supports compatibility with a variety of modern components.

No. of Terminals: 64

A higher number of terminals allows for more complex connections and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Low profile and fine pitch design enhances space-saving capabilities, ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

Broader voltage range provides operational flexibility and efficiency under varying supply conditions.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance makes it suitable for industrial environments.

CPU Family: ARM7

The ARM7 family offers a balance of performance and power efficiency, making it ideal for demanding applications.

Minimum Operating Temperature: -40 °C

Extreme low temperature capability enhances reliability in harsh environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish ensures better electrical conductivity and corrosion resistance.

ADC Channels: YES

Built-in ADC support allows for direct sensor interfacing, enhancing versatility for various applications.

Terminal Position: BOTTOM

Bottom-positioned terminals optimize space on the PCB and improve soldering processes.

ROM Words: 65536

Sufficient ROM capacity supports complex firmware and application software.

Maximum Seated Height: 1.7 mm

Low height contributes to slim product designs, ideal for portable devices.

Width: 8 mm

Compact width supports space-constrained designs in modern electronics.

Maximum Clock Frequency: 16.5 MHz

Adequate clock speed provides sufficient processing power for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Robust reflow characteristics make it reliable for automated manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature withstands advanced soldering processes, ensuring durability.

Length: 8 mm

Dimensions are optimized for compact PCB layouts and efficient use of space.

Temperature Grade: INDUSTRIAL

Industrial temperature rating means reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, contributing to enhanced performance.

RAM Bytes: 16384

Adequate RAM capacity supports complex tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption, ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates better heat dissipation and robust connections.

Maximum Supply Current: 100 mA

Moderate current draw ensures efficient power usage suitable for various applications.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage promotes commonality with many other components, simplifying design.

PWM Channels: YES

Integrated PWM channels enable flexible control for motors and other devices.

ROM Programmability: FLASH

Flash programmability allows easy updates and reprogramming, ensuring long-term usability.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density designs, making it suitable for modern, compact applications.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity indicates some care is required during handling and assembly.

Speed: 66 rpm

Operational speed provides sufficient performance for many automation and control applications.

No. of I/O Lines: 32

Diverse I/O line availability facilitates connection of various peripherals and devices.

Technical Specifications

Microcontrollers STR715FR0H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR715FR0H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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