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STR710RZT6

STMicroelectronics

STR710RZT6 by STMicroelectronics

STR710RZT6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85 °C. It features 144 terminals, supports multiple connectivity options like CAN and USB, and includes ADC channels for enhanced functionality. Ideal for embedded applications requiring reliable performance in compact designs.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 4,515 parts In-Stock

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Vyrian

USA . 4,134 parts In-Stock

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Anansix

USA . 990 parts In-Stock

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990

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Classic Components Corporation

USA . 57 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 787 parts In-Stock

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$12.490

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787

$12.490

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IDEA Electronic Components Group

UK . 1,318 parts In-Stock

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$21.327

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$19.194

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$21.327

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MKK Technologies

India . 1,527 parts In-Stock

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$40.103

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1,527

$40.103

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DigiPath Technology Company

USA . 1,527 parts In-Stock

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$40.103

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$40.103

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Component Stockers USA

USA . 632 parts In-Stock

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$99.990

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632

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QUARKTWIN TECHNOLOGY LTD

USA . 21,982 parts In-Stock

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Microchip USA

USA . 6,720 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,896 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

USA . 2,510 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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Parana Technologies

USA . 1,997 parts In-Stock

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$25.499

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Metaverse IC Inc.

Canada . 1,800 parts In-Stock

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Corphita

USA . 658 parts In-Stock

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Kepictronics

USA . 67 parts In-Stock

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Overview

Unlock the potential of your next project with the STR710RZT6 microcontroller from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers cutting-edge solutions that empower various applications—from industrial automation to consumer electronics. With its robust performance, low power consumption, and versatile connectivity options, the STR710RZT6 ensures seamless integration and longevity, helping you bring your ideas to life with confidence and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on PCBs, crucial for modern electronic devices.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances safety, reduces power consumption, and makes it compatible with a wide range of devices.

Address Bus Width: 24

A 24-bit address bus allows for a larger addressable memory space, improving the capability to handle complex applications.

Package Shape: SQUARE

The square package design allows for organized layout on PCBs, which can aid in heat dissipation and improve overall product aesthetics.

Bit Size: 32

A 32-bit architecture provides greater processing power and the ability to handle more complex computations, suitable for demanding applications.

Power Supplies (V): 3.3

Operating at 3.3V ensures low power consumption, making it ideal for battery-operated devices and energy-efficient designs.

No. of Terminals: 144

A higher number of terminals allows for increased connectivity options, enabling integration of multiple functions within the same chip.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style facilitates easier soldering in automated assembly processes, which enhances manufacturing efficiency.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum of 3V allows for flexibility in power supply options, accommodating a variety of applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller is suitable for industrial applications where heat may be a concern.

CPU Family: ARM7

The ARM7 CPU family is well-regarded for its performance efficiency and a wide range of software support, making it a popular choice for developers.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability and performance in extreme conditions, making it ideal for outdoor and industrial use.

Terminal Finish: MATTE TIN

Matte tin finishing provides excellent solderability and helps prevent oxidation, ensuring long-term reliability and performance.

ADC Channels: YES

Integrated Analog-to-Digital Conversion channels facilitate sensor integration, critical for real-time monitoring and data acquisition.

Terminal Position: QUAD

Quad terminal positioning allows for better thermal management and easier PCB layout, optimizing the performance of the microcontroller.

Maximum Seated Height: 1.6 mm

A low profile height enables space-saving designs, essential in compact applications.

Width: 20 mm

Standard width facilitates compatibility with existing designs and layout practices.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data transfer rates, improving the overall performance of applications.

Peripherals: RTC, TIMER(5)

Incorporated peripherals add functionality without the need for additional components, streamlining design efforts.

Maximum Clock Frequency: 16.5 MHz

A 16.5 MHz clock frequency provides a balance between speed and power consumption, suitable for many microcontroller applications.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum reflow time indicates compatibility with standard surface mount soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

Supporting standard reflow temperatures enhances solderability and manufacturability of the microcontroller.

Length: 20 mm

The standard length facilitates simple mounting on PCBs, aiding in design and assembly.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures ensures robust performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is known for its efficiency and speed, providing a strong foundation for high-performance applications.

RAM Bytes: 65536

With 64KB of RAM, the microcontroller can handle moderate data processing and storage needs effectively.

Technology: CMOS

CMOS technology allows for low static power consumption, essential for battery-operated and energy-sensitive devices.

Terminal Form: GULL WING

Gull wing leads provide excellent mechanical support and reliable soldering capability for surface mounting.

Analog To Digital Convertors: 4-Ch 12-Bit

Four-channel 12-bit ADCs provide enhanced precision in data conversion, making it suitable for high-accuracy applications.

Maximum Supply Current: 100 mA

The microcontroller's current capacity is adequate for driving peripherals, facilitating power budget management in designs.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V optimizes compatibility with modern low-power circuits and systems.

PWM Channels: YES

Integrated PWM channels are critical for motor control and dimming applications, enhancing the versatility of the microcontroller.

Connectivity: CAN, I2C(2), SMARTCARD, SPI(2), UART(4), USB

Diverse connectivity options enable integration with various communication protocols, increasing the range of applications.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, ensuring longevity and adaptability of the product.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packing on PCBs, essential for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures that the microcontroller can withstand standard soldering processes while highlighting the need for proper handling pre-assembly.

Speed: 66 rpm

The specified speed can relate to application-specific functionalities, providing flexibility in design parameters.

No. of I/O Lines: 48

A high number of I/O lines allows for extensive interfacing, making it suitable for complex embedded applications.

Technical Specifications

Microcontrollers STR710RZT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), SMARTCARD, SPI(2), UART(4), USB

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR710RZT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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