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STP8NM60ND

STMicroelectronics

STP8NM60ND by STMicroelectronics

STP8NM60ND by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 600V breakdown voltage, 28A pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$1.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Master Electronics

USA . 35 parts In-Stock

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$1.720

10k+ parts

$1.590

35

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$1.590

Chip1Stop

Japan . 35 parts In-Stock

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Chip Stock

USA . 15,167 parts In-Stock

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Vyrian

USA . 7,080 parts In-Stock

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Digiode

USA . 1,959 parts In-Stock

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1,959

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Avant Electronics Limited

UK . 1,000 parts In-Stock

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Anansix

USA . 333 parts In-Stock

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Bristol Electronics

USA . 45 parts In-Stock

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IDEA Electronic Components Group

UK . 1,597 parts In-Stock

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$0.444

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$0.400

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$0.444

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$0.400

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MKK Technologies

India . 1,499 parts In-Stock

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$0.836

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$0.836

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$0.836

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$0.836

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AZTECH Wire

Italy . 261 parts In-Stock

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$15.380

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kepictronics

USA . 13,865 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,446 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,497 parts In-Stock

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4,497

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Parana Technologies

USA . 1,079 parts In-Stock

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$0.531

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1,079

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$0.531

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Corphita

USA . 587 parts In-Stock

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Overview

Unlock unparalleled performance with the STP8NM60ND from STMicroelectronics, a powerhouse in power management solutions. Engineered for efficiency, this N-channel MOSFET excels in demanding switching applications, offering superior reliability and robustness. With STMicroelectronics' renowned commitment to quality, enjoy enhanced energy savings and thermal stability. Elevate your designs and drive innovative projects forward—experience the difference that exceptional engineering can bring!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection from environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, which allows for faster switching speeds and higher efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added functionality, allowing for easy integration and improved performance in applications requiring flyback protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable operation in power management and control circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle large voltages, making it ideal for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, ensuring reliable connections in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of conductivity, leading to improved performance in switching applications.

Maximum Pulsed Drain Current (IDM): 28 A

A high pulsed drain current rating enables the transistor to handle transient loads, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating indicates resistance to transient voltage spikes, providing enhanced reliability in power management applications.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A allows for substantial power handling capabilities in industrial and commercial projects.

No. of Terminals: 3

Having three terminals facilitates simple connections and ease of use in circuit design.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation capability allows for efficient thermal management, extending the product's operational life in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting style offers secure attachment, improving thermal dissipation and mechanical stability in high-stress environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology ensures high efficiency and lower heat generation, making it suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures allows for use in demanding environments, ensuring reliability under stress.

Transistor Element Material: SILICON

Silicon as a material ensures excellent performance and reliability, characteristic of established technology in FET designs.

Terminal Finish: MATTE TIN

Matte tin finishes enhance solderability, ensuring robust connections and ease of manufacturing.

Maximum Drain Current (ID): 7 A

Reiterating a maximum drain current of 7 A emphasizes its capability in handling substantial loads, ensuring versatility across applications.

Maximum Drain-Source On Resistance: 0.7 ohm

A low on-resistance minimizes power loss during operation, resulting in improved efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position streamlines design and layout in circuit boards, making assembly simpler.

Technical Specifications

Power Field Effect Transistors (FET) STP8NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP8NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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