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STP80NF55-06FP

STMicroelectronics

STP80NF55-06FP by STMicroelectronics

STP80NF55-06FP by STMicroelectronics is a N-channel FET with 55V DS breakdown voltage, 240A IDM, and 0.0065 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 175°C max temp. Package: PLASTIC/EPOXY, RECTANGULAR shape, THROUGH-HOLE terminals.

Median Price

$1.670

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$1.670

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Chip Stock

USA . 51,680 parts In-Stock

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R&J Components

USA . 17,630 parts In-Stock

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Bristol Electronics

USA . 6,785 parts In-Stock

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Digiode

USA . 4,477 parts In-Stock

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Vyrian

USA . 3,859 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 2,240 parts In-Stock

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Anansix

USA . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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200

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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ComSIT USA

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Component Stockers USA

USA . 2,051 parts In-Stock

1+ parts

$0.960

100+ parts

$0.910

1k+ parts

$0.890

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2,051

$0.960

$0.910

$0.890

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Aztec Data Supply Inc.

USA . 1,636 parts In-Stock

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$1.100

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IDEA Electronic Components Group

UK . 1,179 parts In-Stock

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$1.265

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$1.138

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Argo Parts USA

USA . 1,873 parts In-Stock

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$1.670

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Continental Prestige Electronics

USA . 1,576 parts In-Stock

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$1.670

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$1.637

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Netroflash

USA . 100 parts In-Stock

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$1.670

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100

$1.670

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Corohmni

South Africa . 205 parts In-Stock

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$1.939

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MKK Technologies

India . 309 parts In-Stock

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$2.379

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DigiPath Technology Company

USA . 309 parts In-Stock

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$2.379

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Andel Nordic

Denmark . 798 parts In-Stock

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$6.691

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$6.423

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$6.423

798

$6.691

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$6.423

AZTECH Wire

Italy . 189 parts In-Stock

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$10.452

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$31.050

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Semicontronic

India . 1,158 parts In-Stock

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$46.050

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$44.899

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$44.668

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Lixinc

USA . 9,394 parts In-Stock

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Perfect Parts

USA . 7,896 parts In-Stock

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Kepictronics

USA . 5,006 parts In-Stock

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Corphita

USA . 4,694 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,514 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Parana Technologies

USA . 1,609 parts In-Stock

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$1.512

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$6.451

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Assy Fe

Spain . 100 parts In-Stock

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Overview

Unlock the power of innovation with the STP80NF55-06FP by STMicroelectronics. Crafted with precision and expertise, this Power Field Effect Transistor delivers unmatched performance in switching applications. With a maximum pulsated drain current of 240A and an impressive avalanche energy rating of 1300mJ, this N-channel transistor is designed to exceed expectations. Whether you're looking to boost efficiency or enhance productivity, this product offers the reliability and quality that customers trust. Experience the difference with STMicroelectronics and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type - N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them efficient for switching applications.

Minimum DS Breakdown Voltage - 55 V

The high breakdown voltage allows for reliable operation and protection against voltage spikes or overloads.

Configuration - SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse voltage spikes, making it convenient for switching applications.

Transistor Application - SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Maximum Pulsed Drain Current (IDM) - 240 A

The high pulsed drain current rating allows for handling sudden current surges or spikes without damaging the FET.

Maximum Power Dissipation (Abs) - 50 W

The high power dissipation capability ensures the FET can handle high-power applications effectively without overheating.

Maximum Operating Temperature - 175 °C

The high maximum operating temperature allows the FET to be used in demanding environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) STP80NF55-06FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP80NF55-06FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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