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STP85NF55L

STMicroelectronics

STP85NF55L by STMicroelectronics

STP85NF55L by STMicroelectronics is a N-CHANNEL FET with 55V DS Breakdown Voltage, 320A IDM, and 0.01 ohm RDS(on). It's used for SWITCHING applications due to its 300W Pdiss, ENHANCEMENT MODE operation, and built-in DIODE.

Median Price

$0.958

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.958

100+ parts

-

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50

$0.958

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Chip Stock

USA . 53,500 parts In-Stock

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-

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53,500

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Vyrian

USA . 6,158 parts In-Stock

1+ parts

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6,158

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Digiode

USA . 1,502 parts In-Stock

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1,502

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Anansix

USA . 830 parts In-Stock

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830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.939

100+ parts

-

1k+ parts

$0.901

10k+ parts

-

2,000

$0.939

-

$0.901

-

Continental Prestige Electronics

USA . 6,052 parts In-Stock

1+ parts

$0.958

100+ parts

-

1k+ parts

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10k+ parts

$0.939

6,052

$0.958

-

-

$0.939

Argo Parts USA

USA . 2,142 parts In-Stock

1+ parts

$0.958

100+ parts

-

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2,142

$0.958

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Corohmni

South Africa . 220 parts In-Stock

1+ parts

$1.203

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220

$1.203

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

1+ parts

$1.238

100+ parts

-

1k+ parts

$1.114

10k+ parts

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1,928

$1.238

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$1.114

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Aztec Data Supply Inc.

USA . 4,532 parts In-Stock

1+ parts

$1.390

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4,532

$1.390

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MKK Technologies

India . 228 parts In-Stock

1+ parts

$2.329

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228

$2.329

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$2.329

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228

$2.329

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Andel Nordic

Denmark . 779 parts In-Stock

1+ parts

$2.546

100+ parts

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1k+ parts

$2.444

10k+ parts

$2.444

779

$2.546

-

$2.444

$2.444

AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$10.924

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739

$10.924

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Ampacity Inc.

Singapore . 1,148 parts In-Stock

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$20.050

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$20.050

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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32,000

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Lixinc

USA . 12,600 parts In-Stock

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Perfect Parts

USA . 8,297 parts In-Stock

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8,297

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Alle Elektronik GmbH

Germany . 4,017 parts In-Stock

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4,017

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Corphita

USA . 3,634 parts In-Stock

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3,634

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A-Z Elektronik GmbH

Germany . 2,999 parts In-Stock

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2,999

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Parana Technologies

USA . 1,380 parts In-Stock

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$1.481

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1,380

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$1.481

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Discover the STP85NF55L by STMicroelectronics, a high-quality Power FET designed for switching applications. With a maximum drain current of 80A and a low on-resistance of 0.01 ohm, this transistor offers superior performance and reliability. Its N-channel configuration and built-in diode make it perfect for a variety of power management tasks. Trust in STMicroelectronics' reputation for excellence in semiconductor technology and unlock the potential of your next project with the STP85NF55L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and control in the desired direction.

Transistor Application: SWITCHING

Ideal for applications where quick switching between on and off states is required.

Minimum DS Breakdown Voltage: 55 V

Ensures reliable operation within specified voltage limits.

Maximum Pulsed Drain Current (IDM): 320 A

Can handle high current spikes during operation without damage.

Maximum Power Dissipation (Abs): 300 W

Ability to dissipate heat efficiently, allowing for high power operation.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) STP85NF55L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

980 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP85NF55L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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