Loading...

STP80NF03L

STMicroelectronics

STP80NF03L by STMicroelectronics

STP80NF03L by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and low on-resistance of 0.0065 Ω. This robust FET operates efficiently up to 175 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,561

-

-

-

-

ComSIT Distribution GmbH

Germany . 3,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,638

-

-

-

-

Anansix

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

-

-

-

-

Digiode

USA . 1,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,665

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 504 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

$0.382

10k+ parts

-

504

$0.424

-

$0.382

-

MKK Technologies

India . 1,304 parts In-Stock

1+ parts

$0.798

100+ parts

-

1k+ parts

-

10k+ parts

-

1,304

$0.798

-

-

-

DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$0.798

100+ parts

-

1k+ parts

-

10k+ parts

-

1,304

$0.798

-

-

-

AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$8.890

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$8.890

-

-

-

Component Stockers USA

USA . 730 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$99.990

-

-

-

RC Electronics

USA . 42,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,605

-

-

-

-

Alle Elektronik GmbH

Germany . 3,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,091

-

-

-

-

Parana Technologies

USA . 2,144 parts In-Stock

1+ parts

-

100+ parts

$0.507

1k+ parts

-

10k+ parts

-

2,144

-

$0.507

-

-

Corphita

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Elevate your designs with the STP80NF03L from STMicroelectronics, a trusted leader in semiconductor innovation. This robust N-channel power FET delivers exceptional performance for switching applications, ensuring reliability and efficiency in demanding environments. With its superior thermal management and high pulsed current capabilities, it’s ideal for automotive, industrial, and consumer electronics. Choose STMicroelectronics for unmatched quality and performance that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability in various operating conditions, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency compared to P-channel types, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse polarity and provides additional functionality, streamlining circuit design.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is optimized for fast on/off control, making it a perfect choice for power management applications.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures the FET can handle significant voltage levels, enhancing its robustness in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, making the integration into compact designs easier.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and ease of soldering, making it user-friendly for prototyping and assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for precise control of current flow, offering better efficiency and performance in digital switching applications.

Maximum Pulsed Drain Current (IDM): 320 A

Such a high pulsed drain current capability allows this FET to handle demanding load conditions, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 2300 mJ

A high avalanche energy rating provides enhanced protection against transient events, improving circuit reliability and longevity.

No. of Terminals: 3

With three terminals, this FET simplifies connection and integration into circuits, making it versatile for various designs.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure installation and efficient heat dissipation, essential for maintaining performance under load.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and low power consumption, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 175 °C

The ability to operate at a high temperature ensures reliability in extreme conditions, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material, ensuring compatibility and availability, along with good electronic properties.

Terminal Finish: TIN

Tin terminal finish provides good solderability and oxidation resistance, ensuring reliable electrical connections over time.

Maximum Drain Current (ID): 80 A

With a maximum drain current of 80 A, this FET can drive high current loads efficiently, suitable for power applications.

Maximum Drain-Source On Resistance: 0.0065 ohm

A low on-resistance significantly reduces power losses and improves efficiency, making this FET ideal for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and design processes, aiding engineers in integrating this FET into various projects.

Technical Specifications

Power Field Effect Transistors (FET) STP80NF03L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

2300 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP80NF03L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20