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STP80PF55

STMicroelectronics

STP80PF55 by STMicroelectronics

STP80PF55 by STMicroelectronics is a P-CHANNEL FET with 55V DS Breakdown Voltage, 320A IDM, and 0.018 ohm RDS(on). Ideal for SWITCHING applications, it has a max power dissipation of 300W and operates at up to 175°C.

Median Price

$2.663

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.476

100+ parts

-

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100

$1.476

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Component Electronics Inc.

Canada . 1 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

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-

1

$3.850

$2.880

$2.500

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Vyrian

USA . 2,042 parts In-Stock

1+ parts

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2,042

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Digiode

USA . 2,010 parts In-Stock

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2,010

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Chip Stock

USA . 975 parts In-Stock

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975

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Anansix

USA . 326 parts In-Stock

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326

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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Semi Source

USA . 9 parts In-Stock

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9

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Sensible Micro Corp

USA . 8 parts In-Stock

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8

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Flex Direct, LLC

USA . 6 parts In-Stock

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6

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,630 parts In-Stock

1+ parts

$1.087

100+ parts

-

1k+ parts

$0.979

10k+ parts

-

1,630

$1.087

-

$0.979

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.446

100+ parts

-

1k+ parts

$1.389

10k+ parts

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50

$1.446

-

$1.389

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Continental Prestige Electronics

USA . 5,749 parts In-Stock

1+ parts

$1.476

100+ parts

-

1k+ parts

-

10k+ parts

$1.446

5,749

$1.476

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-

$1.446

Argo Parts USA

USA . 1,429 parts In-Stock

1+ parts

$1.476

100+ parts

-

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1,429

$1.476

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Aztec Data Supply Inc.

USA . 452 parts In-Stock

1+ parts

$1.500

100+ parts

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452

$1.500

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Corohmni

South Africa . 319 parts In-Stock

1+ parts

$1.765

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319

$1.765

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Advanced Electronics

New Zealand . 34 parts In-Stock

1+ parts

$1.931

100+ parts

$1.835

1k+ parts

$1.835

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34

$1.931

$1.835

$1.835

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MKK Technologies

India . 431 parts In-Stock

1+ parts

$2.045

100+ parts

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431

$2.045

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DigiPath Technology Company

USA . 431 parts In-Stock

1+ parts

$2.045

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431

$2.045

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$9.891

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573

$9.891

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Ampacity Inc.

Singapore . 300 parts In-Stock

1+ parts

$45.050

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300

$45.050

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Semicontronic

India . 158 parts In-Stock

1+ parts

$63.050

100+ parts

$61.474

1k+ parts

$61.158

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158

$63.050

$61.474

$61.158

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Kepictronics

USA . 13,220 parts In-Stock

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Perfect Parts

USA . 11,103 parts In-Stock

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RC Electronics

USA . 9,535 parts In-Stock

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9,535

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A-Z Elektronik GmbH

Germany . 6,287 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,685 parts In-Stock

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4,685

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Corphita

USA . 3,758 parts In-Stock

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3,758

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,894 parts In-Stock

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1,894

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Parana Technologies

USA . 1,872 parts In-Stock

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$1.300

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1,872

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$1.300

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Assy Fe

Spain . 1,013 parts In-Stock

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1,013

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Lixinc

USA . 622 parts In-Stock

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622

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Overview

Experience the superior quality and reliability of the STP80PF55 Power Field Effect Transistor by STMicroelectronics. With a focus on innovation, STMicroelectronics delivers cutting-edge technology that exceeds industry standards. This P-Channel FET is ideal for switching applications, offering enhanced performance and efficiency. Trust in STMicroelectronics to provide you with a product that offers exceptional value, benefits, and advantages, making it the perfect choice for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this power FET lightweight and cost-effective.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer advantages in certain circuit designs, making this product a good choice for specific applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection and convenience, making this power FET suitable for various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET ensures efficient and reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 55 V

The high minimum breakdown voltage makes this FET suitable for applications requiring higher voltage handling capabilities.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy installation and integration into electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections, making this power FET easy to solder onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control and manipulation of the FET's switching behavior, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 320 A

The high maximum pulsed drain current rating ensures the FET can handle sudden spikes in current without damage.

Avalanche Energy Rating (EAS): 1400 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy spikes, increasing its reliability in demanding applications.

Maximum Drain Current (Abs) (ID): 80 A

The high maximum drain current rating allows the FET to handle high continuous currents, making it suitable for power applications.

No. of Terminals: 3

Having only three terminals simplifies circuit design and reduces complexity in system integration.

Maximum Power Dissipation (Abs): 300 W

The high maximum power dissipation rating ensures the FET can handle high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and secure placement in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this FET ideal for power management applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures the FET can operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon material ensures high performance and durability, making this FET a reliable choice for power applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and corrosion resistance, prolonging the FET's lifespan.

Maximum Drain-Source On Resistance: 0.018 ohm

The low drain-source on resistance results in less power loss and improved efficiency in the FET's operation.

Terminal Position: SINGLE

Single terminal position simplifies connections and makes installation easier, enhancing overall usability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) STP80PF55 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP80PF55 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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