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STP80NF03L-04

STMicroelectronics

STP80NF03L-04 by STMicroelectronics

STP80NF03L-04 by STMicroelectronics is a N-channel Power FET with 30V DS breakdown voltage, 320A IDM, and 0.0055 ohm RDS(on). It's used for switching applications in enhancement mode with 80A ID and 300W Pd.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 5,923 parts In-Stock

1+ parts

$1.070

100+ parts

-

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$0.902

10k+ parts

$0.899

5,923

$1.070

-

$0.902

$0.899

Mouser Electronics

USA . 3,150 parts In-Stock

1+ parts

$4.860

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$1.800

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$4.860

$1.800

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Avnet

USA . 26,800 parts In-Stock

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26,800

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Arrow

USA . 5,923 parts In-Stock

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$1.260

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5,923

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$1.260

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Verical

USA . 5,000 parts In-Stock

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$1.260

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5,000

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$1.260

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EBV Elektronik

Germany . 1,000 parts In-Stock

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1,000

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Newark

USA . 688 parts In-Stock

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688

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Distributors (In-Stock)

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Vyrian

USA . 4,842 parts In-Stock

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$0.470

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4,842

$0.470

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Digiode

USA . 4,495 parts In-Stock

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$1.016

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4,495

$1.016

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TME

Poland . 63 parts In-Stock

1+ parts

$1.890

100+ parts

$1.350

1k+ parts

$1.270

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63

$1.890

$1.350

$1.270

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Component Electronics Inc.

Canada . 346 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

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$2.000

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346

$3.080

$2.310

$2.000

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Chip Stock

USA . 46,530 parts In-Stock

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46,530

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Anansix

USA . 1,432 parts In-Stock

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1,432

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ComSIT Distribution GmbH

Germany . 1,195 parts In-Stock

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1,195

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Jameco Electronics

USA . 382 parts In-Stock

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382

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Elcom Components

USA . 363 parts In-Stock

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363

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Sunrise Surplus Inc.

USA . 333 parts In-Stock

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333

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Zilex Electronics Inc.

Canada . 305 parts In-Stock

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305

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Quantum Digital Technology

USA . 94 parts In-Stock

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94

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Manoshevitz Elec. Sales

Israel . 69 parts In-Stock

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69

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First Choice Components Inc.

USA . 39 parts In-Stock

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39

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LWI Electronics Inc

India . 25 parts In-Stock

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25

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,732 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

$0.570

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1,732

$0.634

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$0.570

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Ampacity Inc.

Singapore . 10,886 parts In-Stock

1+ parts

$0.660

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10,886

$0.660

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Corphita

USA . 2,505 parts In-Stock

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$0.963

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2,505

$0.963

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MKK Technologies

India . 1,141 parts In-Stock

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$1.192

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1,141

$1.192

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DigiPath Technology Company

USA . 1,141 parts In-Stock

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$1.192

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1,141

$1.192

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Microchip USA

USA . 227 parts In-Stock

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$24.310

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227

$24.310

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Eastek

USA . 45,550 parts In-Stock

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45,550

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QUARKTWIN TECHNOLOGY LTD

USA . 15,207 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Futuretech Components

Singapore . 11,000 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 5,412 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,417 parts In-Stock

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3,417

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Metaverse IC Inc.

Canada . 1,941 parts In-Stock

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1,941

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Parana Technologies

USA . 1,551 parts In-Stock

1+ parts

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$0.758

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1,551

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$0.758

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Alle Elektronik GmbH

Germany . 1,140 parts In-Stock

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1,140

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the STP80NF03L-04 by STMicroelectronics. Crafted with precision and expertise, this power field effect transistor offers unrivaled performance for switching applications. With a breakthrough design and cutting-edge technology, it delivers unmatched reliability and efficiency. Whether you're designing industrial equipment or automotive systems, this N-channel transistor is your go-to solution. Experience seamless operation and superior functionality with the STP80NF03L-04, setting new standards in the world of electronics. Elevate your projects to new heights with this exceptional component from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high power efficiency and fast switching speeds, making them ideal for applications where high performance is required.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against voltage spikes, enhancing the overall functionality of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for efficient and reliable operation in systems that require frequent on/off switching.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without experiencing failure, providing a safe operating range for various applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to mount and integrate into circuit designs, offering convenience and versatility in installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection and easy soldering, ensuring a reliable electrical connection in the circuit.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current rating allows for handling temporary surge currents, making this FET suitable for applications with varying load requirements.

Avalanche Energy Rating (EAS): 2300 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy transients, ensuring robust performance in demanding conditions.

Maximum Drain Current (Abs) (ID): 80 A

The high maximum drain current rating ensures that the FET can handle high load currents without overheating or breakdown, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation rating allows the FET to handle high power levels without exceeding its thermal limits, ensuring reliable operation under demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and improved thermal performance, making it suitable for applications that require heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high switching speeds and low gate drive requirements, resulting in improved efficiency and performance in power switching applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high temperatures, allowing for reliable operation in environments with elevated heat levels.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance and reliability, ensuring stable operation and long-term durability in various applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and excellent solderability, ensuring a reliable electrical connection in the circuit.

Maximum Drain-Source On Resistance: 0.0055 ohm

Low on-resistance results in reduced power losses and improved efficiency, making this FET an ideal choice for applications where high power handling is required.

Terminal Position: SINGLE

Single terminal position simplifies circuit board layout and connection, making installation and integration easier and more straightforward.

Case Connection: DRAIN

The drain case connection provides a common connection point for the drain terminal, simplifying the circuit design and improving reliability in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP80NF03L-04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

2300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP80NF03L-04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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