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STP7NM80

STMicroelectronics

STP7NM80 by STMicroelectronics

STP7NM80 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 6.5 A and a breakdown voltage of 800 V. It operates in enhancement mode with a power dissipation of up to 90 W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,759 parts In-Stock

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6,759

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Digiode

USA . 3,374 parts In-Stock

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3,374

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Cyclops Electronics Ltd

UK . 450 parts In-Stock

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450

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Anansix

USA . 418 parts In-Stock

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418

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Sunrise Surplus Inc.

USA . 46 parts In-Stock

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46

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Micros

Poland . 40 parts In-Stock

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40

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IDEA Electronic Components Group

UK . 24 parts In-Stock

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$1.391

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$1.252

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24

$1.391

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$1.252

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MKK Technologies

India . 1,177 parts In-Stock

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$2.616

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$2.616

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DigiPath Technology Company

USA . 1,177 parts In-Stock

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$2.616

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$2.616

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AZTECH Wire

Italy . 550 parts In-Stock

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$9.160

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550

$9.160

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Perfect Parts

USA . 8,052 parts In-Stock

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8,052

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Kepictronics

USA . 5,990 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,877 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 1,889 parts In-Stock

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$1.663

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$1.663

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A-Z Elektronik GmbH

Germany . 1,740 parts In-Stock

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Corphita

USA . 974 parts In-Stock

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Overview

Unlock unparalleled performance with the STP7NM80 from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful N-channel FET excels in switching applications, delivering exceptional reliability and efficiency. Experience enhanced energy savings and robust operation across diverse industries, from automotive to industrial automation. Trust in ST's commitment to quality and innovation for superior performance that elevates your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good insulation and durability, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient for switching applications, allowing for faster response times and improved performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's ability to handle negative voltage spikes, protecting against potential damage in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and performance in controlling electrical power.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage ensures reliability and the ability to handle significant voltage levels without failure, expanding its application scope.

Package Shape: RECTANGULAR

The rectangular package design optimizes space on PCBs, facilitating easier integration into compact electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and excellent thermal performance, making installation straightforward and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to low standby power consumption and better efficiency, ideal for low-power applications.

Maximum Pulsed Drain Current (IDM): 26 A

A high pulsed drain current capacity enables the FET to handle power surges, making it suitable for heavy-load applications.

Avalanche Energy Rating (EAS): 240 mJ

A high avalanche energy rating allows this FET to safely recover from transient thermal events, enhancing reliability.

Maximum Drain Current (Abs) (ID): 6.5 A

The maximum drain current value makes it capable of powering various devices effectively without overheating.

No. of Terminals: 3

With three terminals, this FET provides essential functionality in compact designs, simplifying connection and reducing circuit complexity.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability indicates excellent heat management, enhancing the longevity and reliability of the component.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging ensures secure physical mounting, strengthening thermal contact and improving heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides fast switching, high efficiency, and lower power consumption, contributing to overall system performance.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function in challenging environments, enhancing versatility.

Transistor Element Material: SILICON

Silicon is a widely used and reliable material for transistors, ensuring good performance and availability.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain Current (ID): 6.5 A

This repeated value underscores its capability to handle substantial currents, ideal for powering demanding applications.

Maximum Drain-Source On Resistance: 1.05 ohm

Low on resistance minimizes power loss during operation, enhancing efficiency in power management and overall system performance.

Terminal Position: SINGLE

With a single terminal position, this FET reduces complexity in circuit design, facilitating easier layout and integration.

Case Connection: ISOLATED

An isolated case connection improves safety and performance by preventing unwanted electrical interactions with other components.

Technical Specifications

Power Field Effect Transistors (FET) STP7NM80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

1.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP7NM80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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