Loading...

STP7NM50N

STMicroelectronics

STP7NM50N by STMicroelectronics

STP7NM50N by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 500V breakdown voltage and a max drain current of 5A. It operates in enhancement mode with a power dissipation of up to 45W. Ideal for high-temperature environments, it supports efficient circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,403

-

-

-

-

Anansix

USA . 2,863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,863

-

-

-

-

Digiode

USA . 906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

906

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

$0.370

10k+ parts

-

1,428

$0.411

-

$0.370

-

MKK Technologies

India . 1,982 parts In-Stock

1+ parts

$0.773

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

$0.773

-

-

-

DigiPath Technology Company

USA . 1,982 parts In-Stock

1+ parts

$0.773

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

$0.773

-

-

-

AZTECH Wire

Italy . 1,065 parts In-Stock

1+ parts

$11.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,065

$11.190

-

-

-

Component Stockers USA

USA . 387 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$99.990

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,078

-

-

-

-

Perfect Parts

USA . 3,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,060

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,699

-

-

-

-

Parana Technologies

USA . 1,189 parts In-Stock

1+ parts

-

100+ parts

$0.492

1k+ parts

-

10k+ parts

-

1,189

-

$0.492

-

-

Corphita

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

980

-

-

-

-

Overview

Elevate your projects with the STP7NM50N from STMicroelectronics, a powerhouse in the world of N-channel power FETs. Renowned for their quality and reliability, STMicroelectronics delivers unmatched performance tailored for switching applications. This versatile transistor not only ensures superior efficiency but also guarantees durability under high temperatures. Trust in STMicroelectronics for innovative solutions that enhance your designs and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability while also being cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, contributing to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies design and adds protection, making it ideal for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, it enhances efficiency in power management.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage makes this FET suitable for high-voltage applications, ensuring reliability.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making it suitable for demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a normally-off FET which can save power when the device is not in use.

Maximum Pulsed Drain Current (IDM): 20 A

Capable of handling high pulsed currents, this FET is excellent for transient loads in power applications.

Avalanche Energy Rating (EAS): 100 mJ

The capacity to withstand avalanche energy reduces the risk of damage during voltage spikes.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current rating of 5 A makes it versatile for various applications within its limits.

No. of Terminals: 3

A three-terminal configuration simplifies integration in circuit designs and contributes to versatile functionality.

Maximum Power Dissipation (Abs): 45 W

This high power dissipation capability implies better thermal management and reliability in high power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates secure mounting and enhances heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for lower on-resistance and improved efficiency in switching applications.

Maximum Operating Temperature: 150 °C

Operating at high temperatures widens application possibilities in harsh environments.

Transistor Element Material: SILICON

Silicon is standard in FET technology, providing robustness and reliability for the device.

Maximum Drain Current (ID): 5 A

A specified maximum drain current facilitates safe operation within defined limits, improving device longevity.

Maximum Drain-Source On Resistance: 0.78 ohm

Low on-resistance means reduced power losses during operation, making this FET efficient.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and can facilitate cleaner PCB layouts.

Technical Specifications

Power Field Effect Transistors (FET) STP7NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.78 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP7NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20