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STP7NB60

STMicroelectronics

STP7NB60 by STMicroelectronics

STP7NB60 by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage and 28.8A pulsed drain current, ideal for switching applications. It features a single configuration with built-in diode, operating in enhancement mode at max 150 °C temperature. With 1.2 ohm RDS(on) and 125W power dissipation, it offers reliable performance in various power electronics designs.

Median Price

$4.900

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 349 parts In-Stock

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Vyrian

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Anansix

USA . 2,324 parts In-Stock

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Digiode

USA . 1,708 parts In-Stock

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Halfin

Belgium . 230 parts In-Stock

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ABC Electronics Ltd.

UK . 39 parts In-Stock

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R&J Components

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PC Components Company LLC

USA . 20 parts In-Stock

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Bristol Electronics

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ECAB

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IDEA Electronic Components Group

UK . 975 parts In-Stock

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$0.627

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$0.565

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MKK Technologies

India . 1,532 parts In-Stock

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$1.180

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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AZTECH Wire

Italy . 984 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,082 parts In-Stock

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Parana Technologies

USA . 1,792 parts In-Stock

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$0.750

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Corphita

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Perfect Parts

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Assy Fe

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Overview

Power up your projects with the STP7NB60 Power Field Effect Transistor from STMicroelectronics. With a high DS breakdown voltage of 600V and a maximum drain current of 7.2A, this N-channel transistor is perfect for switching applications. The single configuration with built-in diode ensures efficient performance while the metal-oxide semiconductor technology guarantees reliability. Whether you're designing power supplies, motor controls, or lighting systems, the STP7NB60 offers exceptional value, benefits, and advantages that will take your projects to the next level. Choose quality, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can help protect against reverse voltage issues, enhancing the overall reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient performance.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows this transistor to handle higher voltages, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 28.8 A

With a high pulsed drain current rating, this FET can handle large current spikes, making it suitable for applications with varying load demands.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation rating ensures that this transistor can handle high power levels without overheating, increasing its reliability in demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate effectively in harsh environments where temperature fluctuations are common.

Technical Specifications

Power Field Effect Transistors (FET) STP7NB60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

580 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

7.2 A

Maximum Drain Current (ID):

7.2 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

21 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

125 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

39 ns

Trade Compliance

STP7NB60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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