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NTP6N60

Onsemi

NTP6N60 by Onsemi

NTP6N60 by Onsemi is a Power FET with 600V DS Breakdown Voltage, 21A IDM, and 450mJ EAS. Ideal for SWITCHING applications due to N-CHANNEL configuration and ENHANCEMENT MODE operation. Package: PLASTIC/EPOXY, RECTANGULAR shape with THROUGH-HOLE terminals.

Median Price

$0.863

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 79,150 parts In-Stock

1+ parts

-

100+ parts

$0.991

1k+ parts

$0.823

10k+ parts

$0.733

79,150

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$0.991

$0.823

$0.733

DigiKey

USA . 79,150 parts In-Stock

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$0.850

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79,150

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$0.850

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Verical

USA . 79,150 parts In-Stock

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$0.863

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79,150

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$0.863

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Distributors (In-Stock)

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Vyrian

USA . 1,253 parts In-Stock

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$0.674

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$0.674

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Digiode

USA . 2,257 parts In-Stock

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$0.772

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2,257

$0.772

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Distributors (Availability)

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Corohmni

South Africa . 204 parts In-Stock

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$0.674

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204

$0.674

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Corphita

USA . 1,819 parts In-Stock

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$0.732

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1,819

$0.732

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Microchip USA

USA . 9,943 parts In-Stock

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$5.070

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9,943

$5.070

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Continental Prestige Electronics

USA . 79,150 parts In-Stock

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$0.674

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$0.674

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,434 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,710 parts In-Stock

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SupplyDigital Components

Austria . 6,496 parts In-Stock

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Problanco Electronics

Mexico . 5,414 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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TANS Electronics

Latvia . 3,165 parts In-Stock

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Kulean Microsystems

USA . 2,376 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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767

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Overview

Upgrade your power systems with the NTP6N60 from Onsemi, a leading manufacturer in the industry. Designed for high performance and reliability, this N-Channel Power FET is perfect for switching applications, offering a minimum DS breakdown voltage of 600V and a maximum drain-source on resistance of 1.2 ohm. With a maximum power dissipation of 142W and a peak reflow temperature of 235 °C, this transistor provides unparalleled efficiency and durability. Trust Onsemi to deliver quality products that meet your power needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them suitable for many high-power applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows the FET to handle high voltages without failing, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 142 W

With a high power dissipation rating, this FET can handle high amounts of power without overheating, ensuring reliable operation.

Maximum Drain-Source On Resistance: 1.2 ohm

The low on-resistance means that this FET has minimal power loss and high efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) NTP6N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

21 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP6N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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