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NTP6413ANG

Onsemi

NTP6413ANG by Onsemi

NTP6413ANG by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 178A IDM, and 0.028 ohm RDS(on). Ideal for power applications requiring high drain current handling and low on-resistance. Suitable for use in enhancement mode operation at up to 175 °C temperature.

Median Price

$1.348

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

1,085

-

$1.320

$1.100

$0.977

DigiKey

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.650

10k+ parts

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1,085

-

-

$1.650

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Farnell

UK . 1,085 parts In-Stock

1+ parts

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$1.108

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-

1,085

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$1.108

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Verical

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

1,085

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-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 983 parts In-Stock

1+ parts

$1.026

100+ parts

-

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983

$1.026

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Vyrian

USA . 406 parts In-Stock

1+ parts

$1.080

100+ parts

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406

$1.080

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Distributors (Availability)

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Corphita

USA . 2,330 parts In-Stock

1+ parts

$0.972

100+ parts

-

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2,330

$0.972

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$1.080

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123

$1.080

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Microchip USA

USA . 2,774 parts In-Stock

1+ parts

$6.760

100+ parts

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2,774

$6.760

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Kepictronics

USA . 13,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,728 parts In-Stock

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9,728

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RC Electronics

USA . 9,000 parts In-Stock

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9,000

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Problanco Electronics

Mexico . 8,336 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,557 parts In-Stock

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4,557

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Kulean Microsystems

USA . 3,019 parts In-Stock

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TANS Electronics

Latvia . 2,767 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 1,085 parts In-Stock

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$0.876

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1,085

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$0.876

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Perfect Parts

USA . 1,034 parts In-Stock

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1,034

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UHIMA Technologies

Türkiye . 475 parts In-Stock

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475

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SupplyDigital Components

Austria . 275 parts In-Stock

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275

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Overview

Elevate your power management solutions with the NTP6413ANG by Onsemi. As a leader in Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and performance. This N-CHANNEL transistor boasts a single configuration with a built-in diode, making it versatile for various applications. With a maximum pulsed drain current of 178 A and an avalanche energy rating of 200 mJ, this transistor ensures reliable operation under demanding conditions. Experience the value and benefits that Onsemi's NTP6413ANG brings to your projects, from enhanced efficiency to superior power handling capabilities. Choose Onsemi for cutting-edge technology and unmatched reliability in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this a good choice for high-power applications.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage allows this FET to handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 178 A

With a high pulsed drain current rating, this FET can handle short bursts of high current without being damaged.

Maximum Power Dissipation (Abs): 136 W

This FET can dissipate a relatively large amount of power, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating ensures that this FET can operate reliably in high temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NTP6413ANG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

178 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP6413ANG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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