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NTP65N02RG

Onsemi

NTP65N02RG by Onsemi

NTP65N02RG by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 160A IDM, and 0.0105 ohm RDS(on). Ideal for SWITCHING applications due to its 62.5W Pdiss and 150 °C Max Temp. It comes in PLASTIC/EPOXY package with SINGLE configuration and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.493

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57,448 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

57,448

-

$0.475

$0.395

$0.352

DigiKey

USA . 57,448 parts In-Stock

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100+ parts

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$0.590

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57,448

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$0.590

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Verical

USA . 50,911 parts In-Stock

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$0.493

10k+ parts

$0.440

50,911

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-

$0.493

$0.440

Distributors (In-Stock)

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Digiode

USA . 248 parts In-Stock

1+ parts

$0.370

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248

$0.370

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Vyrian

USA . 1,847 parts In-Stock

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$0.390

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1,847

$0.390

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Chip Stock

USA . 76,000 parts In-Stock

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76,000

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Distributors (Availability)

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Corphita

USA . 325 parts In-Stock

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$0.351

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325

$0.351

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Corohmni

South Africa . 104 parts In-Stock

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$0.390

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104

$0.390

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Continental Prestige Electronics

USA . 57,448 parts In-Stock

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100+ parts

$0.358

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57,448

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$0.358

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,898 parts In-Stock

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Problanco Electronics

Mexico . 4,389 parts In-Stock

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4,389

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TANS Electronics

Latvia . 2,988 parts In-Stock

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Kulean Microsystems

USA . 2,790 parts In-Stock

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2,790

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SupplyDigital Components

Austria . 702 parts In-Stock

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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581

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Overview

Experience the superior performance and reliability of the NTP65N02RG Power FET by Onsemi. Crafted with precision and expertise, this N-CHANNEL transistor is perfect for switching applications, offering enhanced efficiency and power management. With a maximum drain current of 65A and a low on-resistance of 0.0105 ohm, this FET provides unmatched value and benefits to customers seeking top-notch quality and performance. Trust Onsemi for cutting-edge technology and optimal functionality in all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor lightweight and durable, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high power applications due to their superior performance characteristics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching operations and protection against reverse current flow.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast and reliable switching behavior.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle high voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 160 A

The high maximum pulsed drain current rating of 160A allows for handling of high currents during short pulses.

Maximum Power Dissipation (Abs): 62.5 W

With a maximum power dissipation of 62.5W, this FET can handle high power levels without overheating.

Maximum Operating Temperature: 150 °C

The maximum operating temperature of 150 °C ensures reliable performance even in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NTP65N02RG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP65N02RG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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