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NTP6410ANG

Onsemi

NTP6410ANG by Onsemi

NTP6410ANG by Onsemi is a single N-channel power FET with a built-in diode, featuring a min DS breakdown voltage of 100V and max pulsed drain current of 305A. Ideal for applications requiring high power dissipation up to 188W, such as in flange mount configurations for enhanced performance in enhancement mode operation.

Median Price

$4.320

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 295 parts In-Stock

1+ parts

$4.320

100+ parts

$2.010

1k+ parts

$1.730

10k+ parts

-

295

$4.320

$2.010

$1.730

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DigiKey

USA . 221 parts In-Stock

1+ parts

$4.320

100+ parts

$2.012

1k+ parts

$1.540

10k+ parts

$1.504

221

$4.320

$2.012

$1.540

$1.504

Flip Electronics (Authorized)

USA . 350 parts In-Stock

1+ parts

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-

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350

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Rochester

USA . 145 parts In-Stock

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-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

145

-

$1.500

$1.340

$1.260

Distributors (In-Stock)

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Digiode

USA . 1,561 parts In-Stock

1+ parts

$1.586

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1,561

$1.586

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Chip Stock

USA . 69,000 parts In-Stock

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69,000

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Vyrian

USA . 8,574 parts In-Stock

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8,574

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ComSIT Distribution GmbH

Germany . 798 parts In-Stock

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798

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Flip Electronics

USA . 350 parts In-Stock

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350

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Contempo Components LLC

USA . 86 parts In-Stock

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86

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Distributors (Availability)

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Corphita

USA . 1,282 parts In-Stock

1+ parts

$1.503

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1,282

$1.503

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Corohmni

South Africa . 186 parts In-Stock

1+ parts

$1.670

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186

$1.670

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Microchip USA

USA . 3,340 parts In-Stock

1+ parts

$21.970

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3,340

$21.970

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 5,318 parts In-Stock

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5,318

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Problanco Electronics

Mexico . 3,522 parts In-Stock

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3,522

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SupplyDigital Components

Austria . 2,079 parts In-Stock

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2,079

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Infinite Electronics LLP (Excess)

. 1,052 parts In-Stock

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1,052

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UHIMA Technologies

Türkiye . 957 parts In-Stock

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957

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Perfect Parts

USA . 865 parts In-Stock

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865

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iodParts Technologies Inc.

India . 798 parts In-Stock

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798

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TANS Electronics

Latvia . 794 parts In-Stock

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Kulean Microsystems

USA . 316 parts In-Stock

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316

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Overview

Experience the ultimate power and efficiency with the NTP6410ANG Power Field Effect Transistor by Onsemi. As a leader in semiconductor technology, Onsemi guarantees top-notch quality and reliability. This N-CHANNEL FET offers enhanced performance with a built-in diode, perfect for a variety of applications. From industrial machinery to renewable energy systems, this transistor provides superior power handling capabilities with a low on-resistance. Trust Onsemi to deliver cutting-edge solutions that exceed expectations and drive innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the power FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in the specified direction, enhancing performance.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage applications with a safety margin for reliable operation.

Maximum Pulsed Drain Current (IDM): 305 A

High current capacity enables handling of surges and peak loads effectively.

Maximum Power Dissipation (Abs): 188 W

Capable of dissipating heat efficiently under high loads, preventing overheating.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Enhances switching speed and efficiency of the FET for better overall performance.

Maximum Drain-Source On Resistance: 0.013 ohm

Low resistance ensures minimal power loss and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTP6410ANG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

305 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP6410ANG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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