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NTP6412ANG

Onsemi

NTP6412ANG by Onsemi

NTP6412ANG by Onsemi is a single N-channel Power FET with a built-in diode, featuring a min DS breakdown voltage of 100V and max pulsed drain current of 240A. Ideal for applications requiring high power dissipation, such as in automotive or industrial settings.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 17 parts In-Stock

1+ parts

$2.530

100+ parts

$1.355

1k+ parts

$1.074

10k+ parts

-

17

$2.530

$1.355

$1.074

-

Mouser Electronics

USA . 413 parts In-Stock

1+ parts

$2.980

100+ parts

$1.360

1k+ parts

$1.050

10k+ parts

-

413

$2.980

$1.360

$1.050

-

DigiKey

USA . 57 parts In-Stock

1+ parts

$2.980

100+ parts

$1.333

1k+ parts

$0.996

10k+ parts

$0.906

57

$2.980

$1.333

$0.996

$0.906

Newark

USA . 536 parts In-Stock

1+ parts

$3.070

100+ parts

$1.400

1k+ parts

$1.070

10k+ parts

-

536

$3.070

$1.400

$1.070

-

Element14

Singapore . 297 parts In-Stock

1+ parts

$3.070

100+ parts

$1.590

1k+ parts

$1.430

10k+ parts

-

297

$3.070

$1.590

$1.430

-

Rochester

USA . 7,290 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

7,290

-

$1.230

$1.020

$0.910

Verical

USA . 5,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

5,075

-

-

$1.275

$1.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 341 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$0.960

-

-

-

TME

Poland . 94 parts In-Stock

1+ parts

$2.740

100+ parts

$1.270

1k+ parts

$1.200

10k+ parts

-

94

$2.740

$1.270

$1.200

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Chip Stock

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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65,000

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Vyrian

USA . 10,759 parts In-Stock

1+ parts

-

100+ parts

-

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10,759

-

-

-

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NAC Semi

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.520

10k+ parts

-

10,750

-

-

$1.520

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,412 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

2,412

$0.909

-

-

-

Corohmni

South Africa . 449 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

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449

$1.010

-

-

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

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13,000

-

-

-

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Eastek

USA . 7,450 parts In-Stock

1+ parts

-

100+ parts

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7,450

-

-

-

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A-Z Elektronik GmbH

Germany . 6,543 parts In-Stock

1+ parts

-

100+ parts

-

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6,543

-

-

-

-

Kulean Microsystems

USA . 4,630 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,630

-

-

-

-

Perfect Parts

USA . 3,424 parts In-Stock

1+ parts

-

100+ parts

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3,424

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-

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Microchip USA

USA . 3,332 parts In-Stock

1+ parts

-

100+ parts

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3,332

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-

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SupplyDigital Components

Austria . 3,221 parts In-Stock

1+ parts

-

100+ parts

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3,221

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-

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Problanco Electronics

Mexico . 2,044 parts In-Stock

1+ parts

-

100+ parts

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2,044

-

-

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TANS Electronics

Latvia . 593 parts In-Stock

1+ parts

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593

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UHIMA Technologies

Türkiye . 249 parts In-Stock

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249

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Authorized Procurement Solutions

USA . 80 parts In-Stock

1+ parts

-

100+ parts

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80

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Overview

Unlock the power of efficient and reliable electronics with the NTP6412ANG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality with this N-CHANNEL Power Field Effect Transistor. Perfect for a wide range of applications, this single transistor with a built-in diode offers unmatched performance and durability. Experience seamless operation and maximize power efficiency with the NTP6412ANG, providing customers with exceptional value and unparalleled benefits. Choose Onsemi for cutting-edge technology that meets your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Minimum DS Breakdown Voltage: 100 V

Suitable for high power applications that require a reliable breakdown voltage.

Maximum Pulsed Drain Current (IDM): 240 A

Capable of handling high current pulses effectively.

Avalanche Energy Rating (EAS): 300 mJ

Offers protection against high energy spikes and surges.

Maximum Power Dissipation (Abs): 167 W

Can dissipate heat efficiently to prevent overheating.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTP6412ANG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.0182 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP6412ANG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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