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STP75NF68

STMicroelectronics

STP75NF68 by STMicroelectronics

STP75NF68 by STMicroelectronics is a powerful N-channel FET designed for high-efficiency applications. It supports a max drain current of 80 A and power dissipation of 190 W, operating up to 175 °C. Ideal for switching and amplification in various electronic circuits.

Median Price

$1.035

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,433 parts In-Stock

1+ parts

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4,433

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Digiode

USA . 1,711 parts In-Stock

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1,711

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Anansix

USA . 314 parts In-Stock

1+ parts

-

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314

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Bristol Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.035

1k+ parts

-

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100

-

$1.035

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Microfarads

USA . 96 parts In-Stock

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96

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$0.848

100+ parts

-

1k+ parts

$0.763

10k+ parts

-

1,211

$0.848

-

$0.763

-

MKK Technologies

India . 1,075 parts In-Stock

1+ parts

$1.595

100+ parts

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1,075

$1.595

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DigiPath Technology Company

USA . 1,075 parts In-Stock

1+ parts

$1.595

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-

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1,075

$1.595

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-

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AZTECH Wire

Italy . 605 parts In-Stock

1+ parts

$21.530

100+ parts

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605

$21.530

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Component Stockers USA

USA . 436 parts In-Stock

1+ parts

$99.990

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436

$99.990

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A-Z Elektronik GmbH

Germany . 6,518 parts In-Stock

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6,518

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Alle Elektronik GmbH

Germany . 3,669 parts In-Stock

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3,669

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Corphita

USA . 2,652 parts In-Stock

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2,652

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 511 parts In-Stock

1+ parts

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100+ parts

$1.014

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511

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$1.014

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Overview

Elevate your designs with the STP75NF68 from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET delivers exceptional performance and reliability, perfect for a wide range of applications, from automotive to industrial systems. With its impressive current handling and thermal efficiency, this device ensures your projects run smoothly and efficiently, providing unmatched value and peace of mind for engineers and OEMs alike. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers excellent protection and durability, making the product suitable for a wide range of environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel design allows for improved efficiency and faster switching speeds, making this FET ideal for high-performance applications.

Configuration: SINGLE

A single configuration provides simplicity in circuit design while maintaining high performance, reducing the complexity of integration into existing systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and thermal management, making it easier to design compact circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures robust mechanical stability and better soldering quality, making the product reliable in harsh conditions.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current of 80 A, this FET can handle high-load applications, making it suitable for power management and energy-efficient systems.

No. of Terminals: 3

The presence of three terminals allows for flexible circuit design and easy integration into various electronic applications.

Maximum Power Dissipation (Abs): 190 W

A maximum power dissipation of 190 W ensures the FET can effectively manage high power levels, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances thermal performance and ease of heat dissipation, ensuring the FET operates reliably under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching capabilities, enhancing the overall efficiency of electronic circuits.

Maximum Operating Temperature: 175 °C

Operating at a maximum temperature of 175 °C allows the FET to function reliably in extreme conditions, suitable for automotive and industrial applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability and resistance to oxidation, ensuring reliable connections in circuit applications.

Maximum Drain Current (ID): 80 A

This specification emphasizes the product's capability to handle substantial current loads without overheating or failing, making it ideal for demanding applications.

Terminal Position: SINGLE

Single terminal position simplifies the design process and reduces potential errors in circuit assembly, enabling more efficient production.

Technical Specifications

Power Field Effect Transistors (FET) STP75NF68 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

STP75NF68 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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