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STP40N60M2

STMicroelectronics

STP40N60M2 by STMicroelectronics

STP40N60M2 by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. It features 136A max pulsed drain current and 0.088 ohm max drain-source resistance. The transistor operates in enhancement mode and has a built-in diode, making it suitable for high-power applications.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,815 parts In-Stock

1+ parts

$3.600

100+ parts

-

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-

10k+ parts

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1,815

$3.600

-

-

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DigiKey

USA . 1,933 parts In-Stock

1+ parts

$5.790

100+ parts

$2.781

1k+ parts

$2.227

10k+ parts

-

1,933

$5.790

$2.781

$2.227

-

Element14

Singapore . 1,815 parts In-Stock

1+ parts

$6.330

100+ parts

$5.360

1k+ parts

$4.640

10k+ parts

-

1,815

$6.330

$5.360

$4.640

-

Farnell

UK . 1,815 parts In-Stock

1+ parts

$6.640

100+ parts

$3.460

1k+ parts

$3.310

10k+ parts

-

1,815

$6.640

$3.460

$3.310

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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Distributors (In-Stock)

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Digiode

USA . 1,617 parts In-Stock

1+ parts

$3.781

100+ parts

-

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1,617

$3.781

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.904

100+ parts

-

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10

$3.904

-

-

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Vyrian

USA . 1,504 parts In-Stock

1+ parts

-

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1,504

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Pegasus Components GmbH

Germany . 500 parts In-Stock

1+ parts

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500

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ComSIT Distribution GmbH

Germany . 375 parts In-Stock

1+ parts

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375

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Anansix

USA . 217 parts In-Stock

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217

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Sunrise Surplus Inc.

USA . 34 parts In-Stock

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34

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

$0.334

10k+ parts

-

1,408

$0.371

-

$0.334

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MKK Technologies

India . 782 parts In-Stock

1+ parts

$0.697

100+ parts

-

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782

$0.697

-

-

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DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

$0.697

100+ parts

-

1k+ parts

-

10k+ parts

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782

$0.697

-

-

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Corohmni

South Africa . 231 parts In-Stock

1+ parts

$0.786

100+ parts

-

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231

$0.786

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Aztec Data Supply Inc.

USA . 3,717 parts In-Stock

1+ parts

$1.764

100+ parts

-

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3,717

$1.764

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Corphita

USA . 4,090 parts In-Stock

1+ parts

$3.582

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-

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4,090

$3.582

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Argo Parts USA

USA . 1,401 parts In-Stock

1+ parts

$3.904

100+ parts

-

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1,401

$3.904

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Ampacity Inc.

Singapore . 1,730 parts In-Stock

1+ parts

$4.110

100+ parts

-

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-

10k+ parts

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1,730

$4.110

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Continental Prestige Electronics

USA . 2,251 parts In-Stock

1+ parts

$4.900

100+ parts

$3.610

1k+ parts

-

10k+ parts

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2,251

$4.900

$3.610

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Semicontronic

India . 1,494 parts In-Stock

1+ parts

$8.940

100+ parts

$8.716

1k+ parts

$8.672

10k+ parts

-

1,494

$8.940

$8.716

$8.672

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Microchip USA

USA . 6,549 parts In-Stock

1+ parts

$18.956

100+ parts

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6,549

$18.956

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iodParts Technologies Inc.

India . 67,760 parts In-Stock

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67,760

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 19,406 parts In-Stock

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19,406

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Infinite Electronics LLP (Excess)

. 12,780 parts In-Stock

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12,780

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RC Electronics

USA . 9,000 parts In-Stock

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9,000

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Lixinc

USA . 7,217 parts In-Stock

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7,217

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A-Z Elektronik GmbH

Germany . 5,595 parts In-Stock

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5,595

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Alle Elektronik GmbH

Germany . 3,272 parts In-Stock

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3,272

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Parana Technologies

USA . 2,248 parts In-Stock

1+ parts

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$0.443

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2,248

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$0.443

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Perfect Parts

USA . 1,478 parts In-Stock

1+ parts

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1,478

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Kepictronics

USA . 60 parts In-Stock

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60

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Overview

Discover the STP40N60M2 by STMicroelectronics, a powerhouse in Power FET technology. Manufactured with precision and expertise, this N-channel transistor is perfect for switching applications, boasting a 600V DS Breakdown Voltage and 136A Maximum Pulsed Drain Current. Its single configuration with built-in diode offers efficiency and reliability, making it a top choice for engineers and designers. With a low on-resistance of just 0.088 ohm, this transistor provides optimal performance while maximizing energy savings. Upgrade your projects with the STP40N60M2 and experience the quality and innovation that STMicroelectronics brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher mobility compared to P-channel FETs, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse voltage spikes, offering added convenience and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient performance in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this FET can handle high voltage applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and space-saving designs in electronic circuits and systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide strong mechanical connections, making it easier to solder the FET onto circuit boards securely.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have lower ON-resistance and are normally-off devices, offering better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 136 A

The high pulsed drain current rating of 136A allows for handling short duration high current spikes, suitable for demanding applications.

Avalanche Energy Rating (EAS): 500 mJ

The high avalanche energy rating of 500mJ indicates the FET's ability to withstand high energy transients, ensuring reliability in harsh conditions.

No. of Terminals: 3

Having 3 terminals simplifies the connection and integration of the FET into electronic circuits, reducing complexity and improving accessibility.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation capabilities, ensuring optimal performance and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high switching speeds, low gate capacitance, and high input impedance, making them ideal for various applications.

Transistor Element Material: SILICON

Silicon-based FETs offer high temperature tolerance, low leakage currents, and better performance characteristics, ensuring long-term reliability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections and long-term reliability.

Maximum Drain Current (ID): 34 A

With a high maximum drain current rating of 34A, this FET can handle high current loads without risk of overheating or performance degradation.

Maximum Drain-Source On Resistance: 0.088 ohm

The low ON-resistance of 0.088 ohm reduces power losses and improves efficiency in switching applications, making the FET an excellent choice.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection, ensuring ease of use and reliability in electronic circuits.

Case Connection: DRAIN

The drain case connection provides enhanced thermal dissipation and helps in maintaining lower operating temperatures, improving overall performance.

Technical Specifications

Power Field Effect Transistors (FET) STP40N60M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

136 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP40N60M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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