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STP40N10FI

STMicroelectronics

STP40N10FI by STMicroelectronics

STP40N10FI from STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 22 A, a breakdown voltage of 100 V, and operates at up to 175 °C. Its compact design ensures efficient performance in power management systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,968 parts In-Stock

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4,968

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Anansix

USA . 2,551 parts In-Stock

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2,551

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Vyrian

USA . 1,371 parts In-Stock

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1,371

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IDEA Electronic Components Group

UK . 1,829 parts In-Stock

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$1.503

100+ parts

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$1.353

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1,829

$1.503

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MKK Technologies

India . 1,181 parts In-Stock

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$2.827

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$2.827

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$2.827

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$2.827

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Parana Technologies

USA . 2,266 parts In-Stock

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$1.797

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Corphita

USA . 1,921 parts In-Stock

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Overview

Elevate your power management solutions with the STP40N10FI from STMicroelectronics, a trusted leader in innovation and quality. This N-channel FET delivers exceptional performance in switching applications, maximizing efficiency while minimizing energy loss. With its robust design and built-in diode, it ensures reliability across diverse industrial settings, empowering engineers to drive advanced projects forward. Experience unmatched durability and superior thermal handling that enhance your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance against environmental factors, ensuring long-term performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide lower on-resistance and higher efficiency, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances operational efficiency by allowing for freewheeling in inductive loads, simplifying circuit design.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flows, making it ideal for power management circuits.

Minimum DS Breakdown Voltage: 100 V

A minimum breakdown voltage of 100V indicates robustness in high-voltage applications, ensuring reliable performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient PCB design and assembly, providing flexibility in layout.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate a secure connection and solderability, making it easy to integrate into various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for higher efficiency and reduced power loss during operation, crucial for energy-sensitive applications.

Maximum Pulsed Drain Current (IDM): 160 A

A high pulsed drain current rating allows the FET to handle significant load surges, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 210 mJ

The avalanche energy rating ensures the FET can tolerate energy spikes, enhancing reliability in transient conditions.

Maximum Drain Current (Abs) (ID): 22 A

A maximum drain current of 22A allows for substantial load handling, ensuring the FET can meet the requirements of high-power applications.

No. of Terminals: 3

The three-terminal design is standard and supports a variety of simple circuit configurations, making integration convenient.

Maximum Power Dissipation (Abs): 45 W

With a power dissipation rating of 45W, this FET can operate efficiently without overheating, increasing its reliability in continuous use.

Package Style (Meter): FLANGE MOUNT

The flange mount packaging style ensures a stable and secure mechanical connection, improving heat dissipation and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for faster switching speeds and higher efficiency compared to other types of FETs, making it highly desirable for modern applications.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C expands application potential in high-temperature environments, reducing the need for extra cooling measures.

Transistor Element Material: SILICON

Silicon as the transistor element material is standard for FETs, ensuring reliability and effectiveness in a wide range of electrical applications.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals enhances solderability and provides resistance to corrosion, ensuring dependable connections in varied environments.

Maximum Drain Current (ID): 22 A

This spec reinforces the ability to carry significant currents, ensuring robust performance in power management applications.

Maximum Drain-Source On Resistance: 0.04 ohm

A low on-resistance minimizes power loss during operation, leading to increased efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies circuit layout and design, allowing for easier integration into various applications.

Case Connection: ISOLATED

The isolated case connection reduces the risk of unintended grounding or short circuits, contributing to safer operation.

Technical Specifications

Power Field Effect Transistors (FET) STP40N10FI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP40N10FI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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